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Title:
TAPE ADHERING DEVICE AND TAPE ADHERING METHOD
Document Type and Number:
WIPO Patent Application WO/2012/086132
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a tape adhering device and a tape adhering method which are capable of eliminating the need for an actuator of ACF tape cutting means. A tape member (Tp) adhered with a separator (Sp) on one surface of an ACF tape (4) is conveyed on a region located directly below a pressing tool (22) in the horizontal direction. ACF tape cutting means (50) which is operated in response to the movement of the pressing tool (22) and coupled with the pressing tool (22) by interlocking means (28, 53b) and which is configured from a pressing member (53) and a blade body (54) opposed to each other is provided laterally to the pressing tool (22). The pressing member (53) is advanced and retreated with respect to the blade body (54) in response to the up and down movement of the pressing tool (22) to form a notch (K) on the ACF tape (4), a section (4S) of the ACF tape formed on the separator tape (Sp) by this notch (K) is then conveyed above an electrode (3) on an edge of a substrate (2), and the pressing tool (22) moves down and up to adhere the section (4S) on the electrode (3).

Inventors:
YAMADA SHINGO
ODAWARA KOZO
Application Number:
PCT/JP2011/006649
Publication Date:
June 28, 2012
Filing Date:
November 29, 2011
Export Citation:
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Assignee:
PANASONIC CORP (JP)
YAMADA SHINGO
ODAWARA KOZO
International Classes:
H01L21/60; B65H41/00; G02F1/1345; H05K3/32
Foreign References:
JP2008192728A2008-08-21
JP2008150144A2008-07-03
JP2003023241A2003-01-24
Attorney, Agent or Firm:
OGURI, Shohei et al. (JP)
Shohei Oguri (JP)
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Claims:



 
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