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Patent Searching and Data


Title:
TAPE APPLICATION DEVICE, TAPE APPLICATION METHOD, AND METHOD FOR MANUFACTURING COMPOSITE MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2021/010318
Kind Code:
A1
Abstract:
An objective of the present invention is to provide a tape application device capable of improving performance relating to tape application onto an application surface when manufacturing a fiber reinforced plastic molded article by applying tape to the application surface, said device being an ATL device 1 provided with an ATL head 3 which presses and applies tape A onto an application surface 5a, wherein the ATL head 3 is provided with a feeder 9 which supplies the tape A to the application surface 5a, a pressing means 10 for pressing the tape A onto the application surface 5a, and a heating means 80 for heating the tape A and/or the application surface 5a, and the feeder 9 is attached to the pressing means 10 via a variable mechanism 9A interposed therebetween such that the angle of application of the tape A to the application surface 5a is 10° or more and 70° or less.

Inventors:
ATSUTA NAOYUKI (JP)
INAGAKI JUN (JP)
TAKEGAMI TOSHIFUMI (JP)
SUGAMORI MASATO (JP)
HATTORI KIMIHIKO (JP)
SHIMIZU NOBUHIKO (JP)
Application Number:
PCT/JP2020/027029
Publication Date:
January 21, 2021
Filing Date:
July 10, 2020
Export Citation:
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Assignee:
TORAY ENG CO LTD (JP)
TORAY INDUSTRIES (JP)
International Classes:
B29C70/38; B29C63/02; B29C65/02; B29C70/16; B29C70/54; B29K105/08
Domestic Patent References:
WO2019122431A12019-06-27
Foreign References:
JP2018149729A2018-09-27
JP2008515665A2008-05-15
JP2017163092A2017-09-14
JP2006264064A2006-10-05
Attorney, Agent or Firm:
IUCHI Ryuji et al. (JP)
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