Title:
TAPE APPLICATION DEVICE, TAPE APPLICATION METHOD, AND METHOD FOR MANUFACTURING COMPOSITE MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2021/010318
Kind Code:
A1
Abstract:
An objective of the present invention is to provide a tape application device capable of improving performance relating to tape application onto an application surface when manufacturing a fiber reinforced plastic molded article by applying tape to the application surface, said device being an ATL device 1 provided with an ATL head 3 which presses and applies tape A onto an application surface 5a, wherein the ATL head 3 is provided with a feeder 9 which supplies the tape A to the application surface 5a, a pressing means 10 for pressing the tape A onto the application surface 5a, and a heating means 80 for heating the tape A and/or the application surface 5a, and the feeder 9 is attached to the pressing means 10 via a variable mechanism 9A interposed therebetween such that the angle of application of the tape A to the application surface 5a is 10° or more and 70° or less.
Inventors:
ATSUTA NAOYUKI (JP)
INAGAKI JUN (JP)
TAKEGAMI TOSHIFUMI (JP)
SUGAMORI MASATO (JP)
HATTORI KIMIHIKO (JP)
SHIMIZU NOBUHIKO (JP)
INAGAKI JUN (JP)
TAKEGAMI TOSHIFUMI (JP)
SUGAMORI MASATO (JP)
HATTORI KIMIHIKO (JP)
SHIMIZU NOBUHIKO (JP)
Application Number:
PCT/JP2020/027029
Publication Date:
January 21, 2021
Filing Date:
July 10, 2020
Export Citation:
Assignee:
TORAY ENG CO LTD (JP)
TORAY INDUSTRIES (JP)
TORAY INDUSTRIES (JP)
International Classes:
B29C70/38; B29C63/02; B29C65/02; B29C70/16; B29C70/54; B29K105/08
Domestic Patent References:
WO2019122431A1 | 2019-06-27 |
Foreign References:
JP2018149729A | 2018-09-27 | |||
JP2008515665A | 2008-05-15 | |||
JP2017163092A | 2017-09-14 | |||
JP2006264064A | 2006-10-05 |
Attorney, Agent or Firm:
IUCHI Ryuji et al. (JP)
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