Title:
TAPE FOR ELECTRONIC COMPONENTS AND METHOD FOR PROCESSING ELECTRONIC COMPONENTS
Document Type and Number:
WIPO Patent Application WO/2020/209043
Kind Code:
A1
Abstract:
Provided are a tape for electronic components capable of adequately following in a short time even a semiconductor wafer having a high bump, and a method for processing electronic components. The tape for electronic components is characterized by having at least one resin layer 3, and is characterized in that: the indenter indention depth of the resin layer 3 at any temperature of 60-80°C measured in accordance with ISO 14577 using a nanoindenter is 10,000-50,000 nm; the thickness of the resin layer 3 is 50-300 μm; and the total thickness is 450 μm or less.
Inventors:
KAWACHIYAMA TAKUYA (JP)
OKURA MASATO (JP)
OKURA MASATO (JP)
Application Number:
PCT/JP2020/012847
Publication Date:
October 15, 2020
Filing Date:
March 24, 2020
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C09J201/00; C09J7/24; C09J7/25; C09J7/35; H01L21/301; H01L21/304; H01L21/683
Foreign References:
| JP2011187832A | 2011-09-22 | |||
| JP2009269940A | 2009-11-19 | |||
| JP2012167247A | 2012-09-06 |
Attorney, Agent or Firm:
MATSUSHITA, Makoto et al. (JP)
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