Title:
TAPE FOR ELECTRONIC DEVICE PACKAGE
Document Type and Number:
WIPO Patent Application WO/2017/168827
Kind Code:
A1
Abstract:
Provided is tape for electronic device package which, when picking up an adhesive layer-equipped metal layer from a pressure-sensitive adhesive tape, can minimize the occurrence of pin indentations due to the deformation of the metal layer by pin ejection of a pickup device, and can minimize the occurrence of voids between the adhesive layer and a body to be coated. This tape 1 for electronic device package comprises a pressure-sensitive adhesive tape 5 having a substrate film 51 and a pressure-sensitive adhesive 52 layer, and a laminate of an adhesive layer 4 and a metal layer 3 provided by lamination on the reverse side of the pressure-sensitive adhesive layer 52 from the substrate film 51, and is characterized in that the metal layer 3 has a tensile strength of at least 350 MPa.
Inventors:
AOYAMA MASAMI (JP)
SUGIYAMA JIROU (JP)
ISHIGURO KUNIHIKO (JP)
SANO TORU (JP)
SUGIYAMA JIROU (JP)
ISHIGURO KUNIHIKO (JP)
SANO TORU (JP)
Application Number:
PCT/JP2016/084926
Publication Date:
October 05, 2017
Filing Date:
November 25, 2016
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01L21/301; H01L23/00; H01L23/29; H01L23/31
Domestic Patent References:
| WO2007094418A1 | 2007-08-23 | |||
| WO2016013572A1 | 2016-01-28 |
Foreign References:
| JP2010120239A | 2010-06-03 | |||
| JP2014194078A | 2014-10-09 |
Attorney, Agent or Firm:
MATSUSHITA, Makoto et al. (JP)
Download PDF: