Title:
TAPE FOR ELECTRONIC DEVICE PACKAGE
Document Type and Number:
WIPO Patent Application WO/2017/168830
Kind Code:
A1
Abstract:
Provided is tape for electronic device package which, when picking up an adhesive layer-equipped metal from a pressure-sensitive adhesive tape, can minimize the occurrence of pin indentations due to the deformation of the metal layer by pin ejection of a pickup device, and can minimize the occurrence of voids between the adhesive layer and the body to be coated. This tape 1 for electronic device package comprises a pressure-sensitive adhesive tape 5 having a substrate film 51 and a pressure-sensitive adhesive layer 52, an adhesive layer 4 provided by lamination on the reverse side of the pressure-sensitive adhesive layer 52 from the substrate film, and a metal layer 3 provided by lamination to the reverse side of the adhesive layer 4 from the pressure-sensitive adhesive layer 52, and is characterized in that the thickness of the metal layer 3 is at least 5 µm but less than 200 µm, and the cohesiveness of the pressure-sensitive adhesive tape 5 and the adhesive layer 4 when the adhesive layer 4 and metal layer 3 are being picked up from the pressure-sensitive tape 5 is 0.03-0.5 N/25 mm.
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Inventors:
AOYAMA MASAMI (JP)
SUGIYAMA JIROU (JP)
ISHIGURO KUNIHIKO (JP)
SANO TORU (JP)
SUGIYAMA JIROU (JP)
ISHIGURO KUNIHIKO (JP)
SANO TORU (JP)
Application Number:
PCT/JP2016/085104
Publication Date:
October 05, 2017
Filing Date:
November 28, 2016
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01L21/301; C09J7/20; C09J11/06; C09J133/00; C09J133/08; C09J133/14; C09J163/00; C09J171/10; C09J175/14; H01L21/60
Domestic Patent References:
| WO2011004825A1 | 2011-01-13 | |||
| WO2014050763A1 | 2014-04-03 |
Foreign References:
| JP4954569B2 | 2012-06-20 | |||
| JP2013219371A | 2013-10-24 | |||
| JP2015220305A | 2015-12-07 | |||
| JP2008308675A | 2008-12-25 |
Attorney, Agent or Firm:
MATSUSHITA, Makoto et al. (JP)
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