Title:
TAPE FOR PROCESSING WAFER
Document Type and Number:
WIPO Patent Application WO/2020/080707
Kind Code:
A1
Abstract:
A tape for processing a wafer, according to one embodiment of the present invention, comprises: a main body part; and an upper peeling part, wherein the main body part includes an adhesive layer and a substrate layer including pigment, and the upper peeling part includes an upper peeling adhesive layer and an upper peeling substrate layer, and wherein adhesive power of the adhesive layer can be enhanced by heat treatment.
Inventors:
NA BYOUNG SOUN (KR)
JEON SEONG HO (KR)
JEON SEONG HO (KR)
Application Number:
PCT/KR2019/012811
Publication Date:
April 23, 2020
Filing Date:
October 01, 2019
Export Citation:
Assignee:
MTI CO LTD (KR)
International Classes:
C09J7/20; C09J7/40; C09J11/04; C09J167/00; C09J183/04; H01L21/67; H01L21/683
Foreign References:
| JP2013172039A | 2013-09-02 | |||
| KR20100088578A | 2010-08-09 | |||
| KR20130108476A | 2013-10-02 | |||
| KR20120028263A | 2012-03-22 | |||
| KR20150042015A | 2015-04-20 | |||
| KR102012905B1 | 2019-08-22 |
Attorney, Agent or Firm:
Y.P.LEE, MOCK & PARTNERS (KR)
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