Title:
TAPE FOR SEMICONDUCTOR PROCESSING, AND METHOD FOR MANUFACTURING TAPE FOR SEMICONDUCTOR PROCESSING
Document Type and Number:
WIPO Patent Application WO/2018/212185
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a tape for semiconductor processing with which it is possible to achieve an excellent usability period, even when an acrylic-based pressure-sensitive adhesive layer is laminated on an adhesive agent layer. This tape 1 for semiconductor processing comprises a base layer 2, a pressure-sensitive adhesive layer 3 provided on the base layer 2, and an adhesive agent layer 4 provided on the pressure-sensitive adhesive layer 3. The pressure-sensitive adhesive layer 3 contains an acrylic-based copolymer and a crosslinking agent, the acid value of the acrylic-based copolymer being 1.0 mgKOH/g or less.
Inventors:
KOYAMA TAICHI (JP)
Application Number:
PCT/JP2018/018775
Publication Date:
November 22, 2018
Filing Date:
May 15, 2018
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01L21/60; H01L21/301; H01L23/29; H01L23/31
Domestic Patent References:
| WO2009113216A1 | 2009-09-17 |
Foreign References:
| JP2015126217A | 2015-07-06 | |||
| JP2011216508A | 2011-10-27 | |||
| JP2016139757A | 2016-08-04 | |||
| JP2012018950A | 2012-01-26 |
Attorney, Agent or Firm:
ABE Hideki et al. (JP)
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