Title:
TAPED SEMICONDUCTOR ELEMENTS
Document Type and Number:
WIPO Patent Application WO/1984/003194
Kind Code:
A1
Abstract:
A structure of a tape of consecutive semiconductor elements is constructed so that each of N consecutive semiconductor elements from the nth element to the (n+N-1)th element has a characteristic within a predetermined characteristic deviation range, and also each of N consecutive elements from the (n+1)th element to the (n+N)th element has a characteristic within that characteristic deviation range. Thus, when assembling a circuit or device using N elements starting from an element at any desired position, e.g., when using N elements from the nth element to the (n+N-1)th element, if, for example, the nth element is defective because of an error in mounting or another problem, it is possible to assemble the circuit or device using the N elements from the (n+1)th element to the (n+N)th element.
More Like This:
| WO/2003/037718 | METHOD AND APPARATUS FOR FLATTENING COVER TAPE |
| JP2002240802 | TAPING DEVICE |
Inventors:
MATSUMOTO SHIGEO (JP)
IGARASHI TSUTOMU (JP)
IGARASHI TSUTOMU (JP)
Application Number:
PCT/JP1984/000040
Publication Date:
August 16, 1984
Filing Date:
February 10, 1984
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
B65B15/04; H05K13/00; (IPC1-7): H05K13/00; B65D73/02
Foreign References:
| US4344219A | 1982-08-17 |
Other References:
See also references of EP 0137045A1
Download PDF: