Title:
TC-SAW DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2020/186667
Kind Code:
A1
Abstract:
A TC-SAW device, comprising a piezoelectric material substrate and an interdigital electrode provided on the piezoelectric material substrate, and further comprising a temperature compensation layer covering the interdigital electrode, a third metal PAD layer on the piezoelectric material substrate and an outermost passivation layer. A method for manufacturing a TC-SAW device comprises the steps of coating a photoresist layer, depositing a metal thin film, depositing a first layer of an interdigital electrode, depositing a second layer of an electrode, depositing a temperature compensation material, depositing a passivation layer for isolating air, etc. The temperature coefficient of the TC-SAW device can reach 0 ppm/K to -25 ppm/K, the frequency thereof is more stable, and the Q value thereof is higher, such that the device can satisfy the high requirements of mobile communication devices. The manufacturing method can be used to manufacture elements, such as resonators, filters and duplexers, and can be widely used.
Inventors:
SONG CHONGXI (CN)
YAO YANLONG (CN)
YAO YANLONG (CN)
Application Number:
PCT/CN2019/096286
Publication Date:
September 24, 2020
Filing Date:
July 17, 2019
Export Citation:
Assignee:
SHENZHEN MICROGATE TECH LTD (CN)
International Classes:
H03H9/02
Foreign References:
| CN103119847A | 2013-05-22 | |||
| US20180034439A1 | 2018-02-01 | |||
| CN107979353A | 2018-05-01 | |||
| CN109217841A | 2019-01-15 |
Attorney, Agent or Firm:
SHENZHEN QIANNA PATENT AGENCY LTD (CN)
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