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Title:
TECHNIQUE FOR INCREASING THROUGHPUT FOR CHANNEL BONDING
Document Type and Number:
WIPO Patent Application WO/2017/156370
Kind Code:
A3
Abstract:
Certain aspects of the present disclosure provide methods and apparatus for performing communications using a bonded channel across multiple channels.

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Inventors:
SANDEROVICH AMICHAI (US)
AHARON MORDECHAY (US)
EITAN ALECSANDER PETRU (US)
Application Number:
PCT/US2017/021741
Publication Date:
October 19, 2017
Filing Date:
March 10, 2017
Export Citation:
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Assignee:
QUALCOMM INC (US)
International Classes:
H04B7/08; H04L25/06; H04W74/00
Domestic Patent References:
WO2009154406A22009-12-23
WO2012040495A12012-03-29
WO2007146685A12007-12-21
Foreign References:
US20150188596A12015-07-02
Other References:
CARLOS CORDEIRO (INTEL): "Specification Framework for TGay ; 11-15-1358-08-00ay-specification-framework-for-tgay", vol. 802.11ay, no. 8, 23 November 2016 (2016-11-23), pages 1 - 89, XP068110625, Retrieved from the Internet [retrieved on 20161123]
Attorney, Agent or Firm:
READ, Randol W. et al. (US)
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