Title:
TEMPERATURE ADJUSTMENT DEVICE AND POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/241408
Kind Code:
A1
Abstract:
The present invention relates to a temperature adjustment device for adjusting the temperature of a polishing surface of a polishing pad that is used for polishing a substrate, such as a wafer. The present invention also relates to a polishing device provided with such a temperature adjustment device. A temperature adjustment device (5) is provided with: a heat exchanger (11) having a heating channel (61) and a cooling channel (62) formed inside; a holder (90) disposed above the heat exchanger (11); and a coupling mechanism (80) for detachably fixing the heat exchanger (11) to the holder (90). The coupling mechanism (80) is provided with a first hook (73) fixed to the upper surface of the heat exchanger (11), and a second hook (83) held on the holder (90). The second hook (83) is configured to be engageable with and separable from the first hook (73).
Inventors:
KAMIKI KEISUKE (JP)
MARUYAMA TORU (JP)
MOTOSHIMA YASUYUKI (JP)
MARUYAMA TORU (JP)
MOTOSHIMA YASUYUKI (JP)
Application Number:
PCT/JP2020/019915
Publication Date:
December 03, 2020
Filing Date:
May 20, 2020
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B37/015; B24B37/12; B24B37/34; H01L21/304
Foreign References:
| JP2017077591A | 2017-04-27 | |||
| JP2018030181A | 2018-03-01 | |||
| JP2017148933A | 2017-08-31 | |||
| JP2007181910A | 2007-07-19 | |||
| JP2005262379A | 2005-09-29 | |||
| US20060053598A1 | 2006-03-16 | |||
| US20190056183A1 | 2019-02-21 | |||
| JP2008263120A | 2008-10-30 | |||
| US20190193237A1 | 2019-06-27 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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