Title:
TEMPERATURE CONTROL DEVICE, SUBSTRATE PROCESSING DEVICE, AND TEMPERATURE CONTROL METHOD
Document Type and Number:
WIPO Patent Application WO/2024/048461
Kind Code:
A1
Abstract:
Provided are a temperature control device, a substrate processing device, and a temperature control method with which temperature control accuracy and responsiveness are improved. This temperature control device controls a temperature of a temperature regulating unit by causing a fluid to circulate through the temperature regulating unit, the temperature control device comprising: a first temperature adjusting unit for adjusting the fluid to a first temperature; a second temperature adjusting unit for adjusting the fluid that has been adjusted to the first temperature to a second temperature; a first temperature adjustment flow passage provided between the first temperature adjusting unit and the second temperature adjusting unit; a second temperature adjustment flow passage provided between the second temperature adjusting unit and the temperature regulating unit; and a return flow passage provided between the temperature regulating unit and the first temperature adjusting unit.
Inventors:
ISAGO MASARU (JP)
Application Number:
PCT/JP2023/030779
Publication Date:
March 07, 2024
Filing Date:
August 25, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
G05D23/00
Foreign References:
| JP2021009590A | 2021-01-28 | |||
| JP2021149467A | 2021-09-27 | |||
| JP2013195000A | 2013-09-30 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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