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Patent Searching and Data


Title:
TEMPERATURE-CONTROL SYSTEM AND TEMPERATURE-CONTROL METHOD FOR VEHICLE
Document Type and Number:
WIPO Patent Application WO/2024/057843
Kind Code:
A1
Abstract:
The present invention relates to improvements to a system that comprises a heat medium circuit having a first circuit and a second circuit that can be divided, and that comprises a mechanism capable of handling changes in volume due to change in the temperature of the heat medium. The heat medium circuit comprises: a high-pressure side heat exchanger; a low-pressure side heat exchanger; an outdoor heat exchanger; a temperature controller; a reserve tank configured such that the intake portion of each of a first pump and a second pump can be connected thereto; and a connection valve that places the first pump and the second pump in either, as a connection state thereof to the reserve tank, a one-connection state in which one is connected thereto, or a both-connection state in which both are connected thereto. The heat medium circuit is configured such that a first circuit including the low-pressure side heat exchanger and corresponding to the first pump, and a second circuit including the high-pressure side heat exchanger and corresponding to the second pump can be set in parallel, and is configured such that a series circuit including the low-pressure side heat exchanger and the high-pressure side heat exchanger disposed in series and corresponding to the first pump and the second pump can be set.

Inventors:
ADACHI TOMOYASU (JP)
UKAI TETSUZO (JP)
NAKAGAWA NOBUYA (JP)
KOBAYASHI TAKAYUKI (JP)
YAMAMOTO HIROYUKI (JP)
NOYAMA HIDETO (JP)
SAITO KATSUHIRO (JP)
MORISHITA MASATOSHI (JP)
Application Number:
PCT/JP2023/030154
Publication Date:
March 21, 2024
Filing Date:
August 22, 2023
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND THERMAL SYSTEMS LTD (JP)
International Classes:
B60H1/22
Foreign References:
JP2014201224A2014-10-27
JP2017008847A2017-01-12
JP2017229223A2017-12-28
JP2017019449A2017-01-26
Attorney, Agent or Firm:
OBA, Mitsuru et al. (JP)
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