Title:
TEMPERATURE DETECTION DEVICE AND ASSEMBLY BODY
Document Type and Number:
WIPO Patent Application WO/2019/187570
Kind Code:
A1
Abstract:
A temperature detection device of the present invention is able to improve assembly workability of a coil. A temperature detection device 1 comprising: a temperature sensor 10 that has a thermosensitive element 111 to detect the temperature of a coil 8; a holder 20 that holds the temperature sensor 10 and that positions the coil 8 with respect to the temperature sensor 10; and a clip 30 that is an elastic body that sandwiches the coil 8 and the temperature sensor 10 positioned by the holder 20. The clip 30 is movable between a mounting position that is mounted in the holder 20 when sandwiching the temperature sensor 10 and the coil 8, and a position separated from the temperature sensor 10 when positioning the coil 8 with respect to the temperature sensor 10 using the holder 20.
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Inventors:
AKABA HIROAKI (JP)
YOSHIHARA TAKAMASA (JP)
TAKAHASHI ATSUSHI (JP)
YOSHIHARA TAKAMASA (JP)
TAKAHASHI ATSUSHI (JP)
Application Number:
PCT/JP2019/002410
Publication Date:
October 03, 2019
Filing Date:
January 25, 2019
Export Citation:
Assignee:
SHIBAURA ELECTRONICS CO LTD (JP)
International Classes:
G01K7/00; H02K11/25
Foreign References:
| JP6005893B1 | 2016-10-12 | |||
| JP2015021936A | 2015-02-02 | |||
| JP2014160023A | 2014-09-04 | |||
| JPH07193964A | 1995-07-28 | |||
| JPS605893B2 | 1985-02-14 |
Other References:
See also references of EP 3578941A4
Attorney, Agent or Firm:
OBA, Mitsuru et al. (JP)
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