Title:
TEMPERATURE DISTRIBUTION MEASUREMENT DEVICE, TEMPERATURE DISTRIBUTION MEASUREMENT METHOD, FLUID FLOW MEASUREMENT DEVICE, AND GAS SENSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/172386
Kind Code:
A1
Abstract:
In order to accurately measure a randomly occurring stress distribution, in a stress distribution measurement device in which a temperature distribution measurement device according to the present invention is applied, temperature data of a fixed period are shifted in a time direction for each fixed analysis step and excised from temperature image data of an object to be measured, which is imaged for a predetermined period by an infrared camera for capturing an image of the object to be measured, and partial temperature data are generated (steps S25, S35). Synchronous detection processing is then performed using a reference signal set in advance for each item of partial temperature data, and the distribution of temperature variation for each fixed period, i.e., a stress distribution, is detected on the basis of the partial temperature data after the synchronous detection processing (steps S26, S37).
Inventors:
FUKUDA YOSHINORI (JP)
Application Number:
PCT/JP2019/009152
Publication Date:
September 12, 2019
Filing Date:
March 07, 2019
Export Citation:
Assignee:
JFE TECHNO RES CORPORATION (JP)
International Classes:
G01J5/48; G01L1/00; G01P13/00
Domestic Patent References:
| WO2016036038A1 | 2016-03-10 |
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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