Title:
TEMPERATURE MEASUREMENT DEVICE AND TEMPERATURE MEASUREMENT SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/275924
Kind Code:
A1
Abstract:
A temperature measurement device (20) that comprises: an installation body (21) configured so as to be installed on the ground (RS1); and a temperature sensor (34) configured so as to measure the temperature of the ground (RS1). The installation body (21) comprises: a base surface (22) that is in contact with the ground (RS1); and a demarcation surface (25) that demarcates a housing region (S1) that opens to the base surface (22). The temperature sensor (34) is housed in the housing region (S1). A thermally conductive material (51) that has a higher thermal conductivity than air is provided between the temperature sensor (34) and the ground (RS1).
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Inventors:
SUNAYAMA YUKI (JP)
Application Number:
PCT/JP2021/024328
Publication Date:
January 05, 2023
Filing Date:
June 28, 2021
Export Citation:
Assignee:
TAIHEIYO KOGYO KK (JP)
International Classes:
G01K1/14
Foreign References:
| JP2014528035A | 2014-10-23 | |||
| JP2010071955A | 2010-04-02 | |||
| US20200199832A1 | 2020-06-25 | |||
| JPH0447636U | 1992-04-22 | |||
| JPH01248031A | 1989-10-03 |
Attorney, Agent or Firm:
ONDA Makoto et al. (JP)
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