Title:
TEMPERATURE SENSING MATERIAL TYPE THERMAL FUSE
Document Type and Number:
WIPO Patent Application WO/2003/092028
Kind Code:
A1
Abstract:
A temperature sensing material type thermal fuse selectively using a temperature sensing material (3) by turning attention to the physical and chemical characteristics of the temperature sensing material (3), comprising the temperature sensing material (3) formed of a thermoplastic resin fusing at a specified temperature, a cylindrical envelope (1) for storing the temperature sensing material, a first lead member (2) forming a first electrode fitted to one end opening of the envelope, a second lead member (10) forming a second electrode fitted to the other end opening of the envelope, a movable conductive member (7) stored in the envelope and anchored to the temperature sensing material, and spring members (6, 8) stored in the envelope and pressingly acting on the movable conductive member, wherein the temperature sensing material fuses at an operating temperature to switch an electric circuit between the first electrode and the second electrode.
Inventors:
Yoshikawa, Tokihiro c/o NEC SCHOTT COMPONENTS CORPORATION (3-1 Nichiden, Minakuchi-ch, Koka-shi Shiga, 528-0034, JP)
Application Number:
PCT/JP2003/005126
Publication Date:
November 06, 2003
Filing Date:
April 22, 2003
Export Citation:
Assignee:
NEC SCHOTT COMPONENTS CORPORATION (3-1 Nichiden, Minakuchi-cho Koka-shi, Shiga, 528-0034, JP)
Yoshikawa, Tokihiro c/o NEC SCHOTT COMPONENTS CORPORATION (3-1 Nichiden, Minakuchi-ch, Koka-shi Shiga, 528-0034, JP)
Yoshikawa, Tokihiro c/o NEC SCHOTT COMPONENTS CORPORATION (3-1 Nichiden, Minakuchi-ch, Koka-shi Shiga, 528-0034, JP)
International Classes:
H01H37/76; (IPC1-7): H01H37/76
Attorney, Agent or Firm:
Fukami, Hisao (Fukami Patent Office, Mitsui Sumitomo Bank Minamimorimachi Bldg.
1-29, Minamimorimachi 2-chome, Kita-k, Osaka-shi Osaka, 530-0054, JP)
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