TEMPERATURE-SENSITIVE ADHESIVE TAPE AND TEMPERATURE-SENSITIVE ADHESIVE SHEET

WIPO Patent Application WO/2016/158414

A1

This temperature-sensitive adhesive tape is configured such that an adhesive layer that is laminated on one surface or both surfaces of a base is composed of a cured product of a temperature-sensitive adhesive composition. This temperature-sensitive adhesive sheet is composed of a cured product of a temperature-sensitive adhesive composition. The temperature-sensitive adhesive composition is in a liquid state and contains at least a side-chain crystalline (meth)acrylic polymer, a (meth)acrylic monomer, a polyfunctional (meth)acrylate and a photoradical initiator, while having ultraviolet curability. In addition, this temperature-sensitive adhesive composition contains 0.2-1.9 parts by weight of the photoradical initiator relative to 100 parts by weight of the total of the side-chain crystalline (meth)acrylic polymer and the (meth)acrylic monomer.

JP6566178	Paste-like adhesive composition and semiconductor device
JP2008522016	Equipment containing low outgassing light or electron beam curable rubbery polymers
JPH01287115	ANAEROBIC AND MOISTURE-CURABLE TYPE RESIN COMPOSITION

MARUTANI KOSUKE (JP)
NISHIO TOMOHIRO (JP)

PCT/JP2016/058299

October 06, 2016

March 16, 2016

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NITTA CORP (JP)

C09J4/02; C09J7/20; C09J11/06; C09J133/04

JP2009179781A	2009-08-13
JP2011099042A	2011-05-19
JP2012087218A	2012-05-10
JP2009256607A	2009-11-05
JP2007254590A	2007-10-04
JP2016094569A	2016-05-26

FUKAI, Toshikazu (JP)
Toshikazu Fukai (JP)

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