Title:
TEMPERATURE SENSOR AND CHIP
Document Type and Number:
WIPO Patent Application WO/2019/128445
Kind Code:
A1
Abstract:
A temperature sensor, comprising a first circuit (10), a second circuit (20) and an exclusive OR gate circuit (30), the first circuit (10) comprises N first inverters (11), the N first inverters (11) are connected in series to form a ring structure, the second circuit (20) comprises M second inverters (21), the M second inverters (21) are connected in series to form a ring structure, M= N, M and N being positive integers no less than 2; when the temperature sensor is in an operating state, the first circuit (10) outputs a first level, the change in the first level being independent of the temperature, and the second circuit (20) outputs a second level, the change in the second level being related to the temperature; The exclusive OR gate circuit (30) is used to input the first level and the second level, and output a level difference, the level difference being used to determine a temperature value of the temperature sensor. The present invention is used to improve the measurement accuracy of the temperature sensor, and accurately measure the chip temperature of SoC chips. Further disclosed is a chip.
Inventors:
WEI WEI (CN)
ZHOU ZHOU (CN)
ZHOU ZHOU (CN)
Application Number:
PCT/CN2018/112370
Publication Date:
July 04, 2019
Filing Date:
October 29, 2018
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
G01K7/01; G01K13/00
Foreign References:
| CN104483611A | 2015-04-01 | |||
| CN106017730A | 2016-10-12 | |||
| CN104833437A | 2015-08-12 | |||
| CN102338669A | 2012-02-01 |
Attorney, Agent or Firm:
SHENPAT INTELLECTUAL PROPERTY AGENCY (CN)
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