Title:
TEMPERATURE SENSOR AND DEVICE EQUIPPED WITH TEMPERATURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2020/032021
Kind Code:
A1
Abstract:
Provided are a thin and insulating temperature sensor which is heat resistant and can have improved reliability, responsiveness, and temperature measurement accuracy, and a device provided with the temperature sensor, the temperature sensor being provided with: a heat sensitive element (10) which has an insulating substrate (11), a heat sensitive film (13) formed on the insulating substrate (11), and electrode layers (12a), (12b) formed on the insulating substrate (11) and electrically connected to the heat sensitive film (13); a lead member (20) having joint parts (21a), (21b) electrically connected to the electrode layers (12a), (12b) by being joined thereto by means of welding, and lead parts (22a), (22b) integrally extending from the joint parts (21a), (21b); and a pair of insulating films (30a), (30b) which sandwich and seal at least the heat sensitive element (10) and the joint parts (21a), (21b) of the lead member (20) from both sides.
Inventors:
NOJIRI TOSHIYUKI (JP)
Application Number:
PCT/JP2019/030893
Publication Date:
February 13, 2020
Filing Date:
August 06, 2019
Export Citation:
Assignee:
SEMITEC CORP (JP)
International Classes:
G01K7/22; G01J1/02; G01J5/02
Domestic Patent References:
| WO2018066473A1 | 2018-04-12 |
Foreign References:
| JPH08128901A | 1996-05-21 | |||
| JP2004205417A | 2004-07-22 | |||
| JP2017161332A | 2017-09-14 |
Attorney, Agent or Firm:
IZUMI Junichi (JP)
Download PDF:
Previous Patent: HIGH FREQUENCY CIRCUIT BOARD
Next Patent: RESIN COMPOSITION FOR VIBRATION-DAMPING MATERIAL
Next Patent: RESIN COMPOSITION FOR VIBRATION-DAMPING MATERIAL