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Patent Searching and Data


Title:
TEMPERATURE SENSOR AND DEVICE PROVIDED WITH TEMPERATURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2019/087755
Kind Code:
A1
Abstract:
Provided are: a temperature sensor enabling to reduce thickness, increase an area in contact with a subject the temperature of which is to be measured, and improve measurement accuracy; and a device that is provided with the temperature sensor. A temperature sensor (1) is provided with: a thermistor element (2); a lead-out line (3) connected to the thermistor element (2); a lead line (4) connected to the lead-out line (3); an inner layer (6) formed by heating and hardening or by melting and solidifying a pair of sheet-like inner layer material members (61, 62) formed of a resin material; and outer layers (7) formed of a pair of sheet-like outer layer material members (71, 72), each of which is formed of a resin material, and has flat surfaces on both sides. The thermistor element (2), the lead-out line (3), and a connection area between the lead-out line (3) and the lead line (4) are covered with the inner layer (6), and are also covered with the pair of outer layers (7) by being sandwiched therebetween.

Inventors:
OGURA MITSUTOSHI (JP)
Application Number:
JP2018/038303
Publication Date:
May 09, 2019
Filing Date:
October 15, 2018
Export Citation:
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Assignee:
SEMITEC CORP (JP)
International Classes:
G01K7/22
Foreign References:
JPH08128901A1996-05-21
JP5830636B12015-12-09
JP2017161332A2017-09-14
Attorney, Agent or Firm:
IZUMI Junichi (JP)
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