Title:
TEMPERATURE SENSOR AND METHOD FOR MANUFACTURING TEMPERATURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2023/062787
Kind Code:
A1
Abstract:
The present invention provides: a temperature sensor capable of improving responsiveness; and a method for manufacturing said temperature sensor. The present invention also provides: a temperature sensor capable of having an improved degree of freedom with respect to installation; and a method for manufacturing said temperature sensor. A temperature sensor 1 is provided with: a temperature sensing element 10 including a temperature sensing body 11, a lead wire 121 having one end electrically connected to the temperature sensing body 11, and a sealing body 122 comprising an insulating material which covers the temperature sensing body 11 and a portion of the lead wire 121; a lead wire 15 which is electrically connected to another end of the lead wire 121; and a plastic covering body 20 which is elongated, has a rectangular lateral cross-section, and covers the temperature sensing element 10 and a portion of the lead wire 15. The dimension of the covering body 20 in the short direction is set such that the dimension of a region 21 covering the temperature sensing element 10 is smaller than the dimension of a region 22 covering the lead wire 15.
Inventors:
YOSHIHARA TAKAMASA (JP)
TAKEMURA MICHIRU (JP)
TAKEMURA MICHIRU (JP)
Application Number:
PCT/JP2021/038098
Publication Date:
April 20, 2023
Filing Date:
October 14, 2021
Export Citation:
Assignee:
SHIBAURA ELECTRONICS CO LTD (JP)
International Classes:
G01K7/22
Domestic Patent References:
| WO2015132832A1 | 2015-09-11 |
Foreign References:
| JP2016536565A | 2016-11-24 | |||
| JP2012211792A | 2012-11-01 | |||
| JP2006234632A | 2006-09-07 | |||
| US4934831A | 1990-06-19 |
Attorney, Agent or Firm:
OBA, Mitsuru et al. (JP)
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