Title:
TEMPERATURE SENSOR AND METHOD FOR PRODUCING TEMPERATURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2023/139652
Kind Code:
A1
Abstract:
Provided is a thin temperature sensor that can be flattened and is free of extreme restrictions on resin materials used in inner and outer layers. This temperature sensor (1) comprises: a sensor element (10), which is equipped with heat-sensing parts (11, 13) and a pair of electrical wires (15, 17) electrically connected to the heat-sensing part (11); and a holder (30) for holding the sensor element 10. The holder (30) is equipped with an accommodating space (37) in which the heat-sensing parts (11, 13) and the electrical wires (15, 17) are accommodated and which includes a through-hole that opens on the obverse and reverse sides.
Inventors:
SUZUKI TATSUYUKI (JP)
Application Number:
PCT/JP2022/001627
Publication Date:
July 27, 2023
Filing Date:
January 18, 2022
Export Citation:
Assignee:
SHIBAURA ELECTRONICS CO LTD (JP)
International Classes:
G01K1/08
Domestic Patent References:
| WO2019087755A1 | 2019-05-09 |
Foreign References:
| JP2019219173A | 2019-12-26 | |||
| JP2012211792A | 2012-11-01 | |||
| JP2002048655A | 2002-02-15 | |||
| JP2012145527A | 2012-08-02 | |||
| CN210036986U | 2020-02-07 | |||
| JPH08128901A | 1996-05-21 |
Other References:
See also references of EP 4239299A4
Attorney, Agent or Firm:
OBA, Mitsuru et al. (JP)
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