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Title:
TEMPERATURE SENSOR POSITION SETTING METHOD, PROGRAM, AND PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/026406
Kind Code:
A1
Abstract:
This temperature sensor position setting method includes: a step (S20) for setting a tentative temperature value for each area of a target space divided into a plurality of areas; a step (S30) for selecting a candidate area where a temperature sensor is to be installed from among the plurality of areas; a step (S40) for calculating, by an interpolation method, the temperature of the area where the temperature sensor is not installed in a case where the temperature sensor is installed in the selected area; a step (S50) for evaluating the case where the temperature sensor is installed in the selected area on the basis of the difference between the tentative value of each area and the interpolated value calculated by the interpolation method; and a step (S70) for determining the area where the temperature sensor is to be installed on the basis of the results of the evaluation.

Inventors:
MIWA TAKEHISA (JP)
MEGA TOSHIHIRO (JP)
IWAMURA KOHKI (JP)
TAMURA NATSUMI (JP)
KAWASAKI JIN (JP)
Application Number:
PCT/JP2021/031194
Publication Date:
March 02, 2023
Filing Date:
August 25, 2021
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC BUILDING SOLUTIONS CORP (JP)
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
F24F11/89; G01K1/14; G01K7/00; F24F110/10
Domestic Patent References:
WO2021111617A12021-06-10
Foreign References:
JP2017532688A2017-11-02
JP2016507717A2016-03-10
JPH0634176A1994-02-08
US20170205490A12017-07-20
US20150073747A12015-03-12
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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