Title:
TEMPERATURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2021/131493
Kind Code:
A1
Abstract:
In the present invention, a temperature sensor includes: a thermistor; a pair of lead-out lines connected at the front ends thereof to the thermistor; glass that seals the thermistor and the front-end sections of the pair of lead-out lines; a pair of leads connected at the front ends thereof to the back ends of each of the pair of lead-out lines; and a synthetic resin covering layer that covers the glass, portions of the pair of lead-out lines other than the front-end sections, and the front-end sections of the pair of leads. The covering layer, has a tube shape, and is elastically expanded in a state in which an inner layer and an outer layer of the tube shape are layered in advance. The covering layer is forcibly fitted onto the glass, the portions of the pair of lead-out lines other than the front end sections, and the front-end sections of the pair of leads. Heat is then applied so as to melt the inner layer and shrink the outer layer, whereby the covering layer is installed. The peripheral surface of the glass contacts the outer layer directly, without the inner layer being interposed therebetween.
Inventors:
TOBISHIMA KENJI (JP)
OKADA HIROMI (JP)
TAKANO YUJI (JP)
OKADA HIROMI (JP)
TAKANO YUJI (JP)
Application Number:
PCT/JP2020/044266
Publication Date:
July 01, 2021
Filing Date:
November 27, 2020
Export Citation:
Assignee:
OHIZUMI MFG CO LTD (JP)
International Classes:
H01C7/02; G01K7/22; H01C7/04
Domestic Patent References:
| WO2019087755A1 | 2019-05-09 |
Foreign References:
| KR101004404B1 | 2010-12-28 | |||
| JPH0577738U | 1993-10-22 | |||
| JP2019095355A | 2019-06-20 | |||
| JP2008112812A | 2008-05-15 | |||
| JP2004233267A | 2004-08-19 | |||
| JPH01112432U | 1989-07-28 | |||
| JP2005186370A | 2005-07-14 | |||
| JPS5830636B2 | 1983-06-30 |
Other References:
See also references of EP 4084021A4
Attorney, Agent or Firm:
ONO, Hisazumi et al. (JP)
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