Title:
TEMPLATE ASSEMBLY SORTING METHOD, WORKPIECE-POLISHING METHOD, AND TEMPLATE ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2017/195460
Kind Code:
A1
Abstract:
The present invention is a template assembly sorting method comprising: a step for preparing template assemblies in which a template with a back pad for holding the back surface of a workpiece and a retainer ring located on the back pad for holding the edge of the workpiece has been glued concentrically on a base ring or base plate with an outside diameter greater than the outside diameter of the template; a step for non-destructively measuring, on the template-side of the template assembly, the distributions of the retainer ring and back pad height positions when the peripheral surface of the base ring or base plate is used as a reference plane; a step for calculating the flatness of the retainer ring and the average level difference between the retainer ring and the back pad from the measured distributions of height positions; and a step for sorting the template assemblies on the basis of flatness and average level difference. Provided thereby is a template assembly sorting method with which variation in workpiece flatness after polishing can be adjusted.
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| JP4392818 | Polishing equipment |
| WO/2006/014411 | METHOD AND SYSTEM FOR PROCESSING WAFERS |
Inventors:
SATO KAZUYA (JP)
KAMIHAMA NAOKI (JP)
HASHIMOTO HIROMASA (JP)
KAMIHAMA NAOKI (JP)
HASHIMOTO HIROMASA (JP)
Application Number:
PCT/JP2017/010203
Publication Date:
November 16, 2017
Filing Date:
March 14, 2017
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
B24B37/30; G01B11/02; G01B11/24; H01L21/304
Foreign References:
| JP2010247254A | 2010-11-04 | |||
| JP2014233815A | 2014-12-15 | |||
| JP2014184511A | 2014-10-02 | |||
| JP2015196211A | 2015-11-09 | |||
| JP2009260142A | 2009-11-05 | |||
| JP2017087328A | 2017-05-25 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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