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Title:
TEMPORARILY FIXING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2011/077922
Kind Code:
A1
Abstract:
Conventionally, it was difficult to sufficiently affix an adherend when polishing, and to easily peel off the adherend. Disclosed is a non-reactive temporarily fixing composition for plane polishing, wherein the shear strength is 0.05MPa or more, and the peel strength is less than 100N.

Inventors:
NOGAMI YASUTOSHI (JP)
KIRINO MANABU (JP)
SHUNDOH YOSHIMUNE (JP)
KODAIRA SHINYA (JP)
Application Number:
PCT/JP2010/071584
Publication Date:
June 30, 2011
Filing Date:
December 02, 2010
Export Citation:
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Assignee:
THREE BOND CO LTD (JP)
IDEMITSU KOSAN CO (JP)
NOGAMI YASUTOSHI (JP)
KIRINO MANABU (JP)
SHUNDOH YOSHIMUNE (JP)
KODAIRA SHINYA (JP)
International Classes:
B24B37/04; C09J201/00; B24B41/06; C09J123/24; C09J157/00
Foreign References:
JP2004186398A2004-07-02
JP2004284575A2004-10-14
JP2004143420A2004-05-20
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
Hatta international patent business corporation (JP)
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