Title:
TEMPORARILY FIXING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2011/077922
Kind Code:
A1
Abstract:
Conventionally, it was difficult to sufficiently affix an adherend when polishing, and to easily peel off the adherend. Disclosed is a non-reactive temporarily fixing composition for plane polishing, wherein the shear strength is 0.05MPa or more, and the peel strength is less than 100N.
Inventors:
NOGAMI YASUTOSHI (JP)
KIRINO MANABU (JP)
SHUNDOH YOSHIMUNE (JP)
KODAIRA SHINYA (JP)
KIRINO MANABU (JP)
SHUNDOH YOSHIMUNE (JP)
KODAIRA SHINYA (JP)
Application Number:
PCT/JP2010/071584
Publication Date:
June 30, 2011
Filing Date:
December 02, 2010
Export Citation:
Assignee:
THREE BOND CO LTD (JP)
IDEMITSU KOSAN CO (JP)
NOGAMI YASUTOSHI (JP)
KIRINO MANABU (JP)
SHUNDOH YOSHIMUNE (JP)
KODAIRA SHINYA (JP)
IDEMITSU KOSAN CO (JP)
NOGAMI YASUTOSHI (JP)
KIRINO MANABU (JP)
SHUNDOH YOSHIMUNE (JP)
KODAIRA SHINYA (JP)
International Classes:
B24B37/04; C09J201/00; B24B41/06; C09J123/24; C09J157/00
Foreign References:
JP2004186398A | 2004-07-02 | |||
JP2004284575A | 2004-10-14 | |||
JP2004143420A | 2004-05-20 |
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
Hatta international patent business corporation (JP)
Hatta international patent business corporation (JP)
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