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Title:
TEMPORARY ADHESIVE CONTAINING POLYSILOXANE THAT CONTAINS HEAT RESISTANT POLYMERIZATION INHIBITOR
Document Type and Number:
WIPO Patent Application WO/2019/212008
Kind Code:
A1
Abstract:
[Problem] To provide a temporary adhesive with which no voids occur between a support body and a wafer. [Solution] This temporary adhesive, for releasably bonding a support body and a circuit surface of a wafer in order enable processing the back surface of the wafer, contains (A) a component which cures with a hydrosilylation reaction, (B) a polymerization inhibitor which has a 5% mass loss temperature in Tg-DTA of greater than or equal to 80°C, and (C) a solvent. The component (A) contains: a polysiloxane (A1) that contains (a1) a polyorganosiloxane containing an alkyl group of 1-10 carbon atoms and an alkenyl group of 2-10 carbon atoms, and (a2) a polyorganosiloxane containing a hydrogen atom and an alkyl group of 1-10 carbon atoms; and (A2) a platinum-group metal-base catalyst. The polymerization inhibitor (B) is a compound represented in formula (1). In formula (1), R7 and R8 are both aryl groups of 6-40 carbon atoms, or are a combination of an alkyl group of 1-10 carbon atoms and an aryl group of 6-40 carbon atoms.

Inventors:
SAWADA, Kazuhiro (Materials Research Laboratories 635, Sasakura, Fuchu-machi, Toyama-sh, Toyama 53, 〒9392753, JP)
MORIYA, Shunsuke (Materials Research Laboratories 635, Sasakura, Fuchu-machi, Toyama-sh, Toyama 53, 〒9392753, JP)
SHINJO, Tetsuya (Materials Research Laboratories 635, Sasakura, Fuchu-machi, Toyama-sh, Toyama 53, 〒9392753, JP)
OGINO, Hiroshi (Materials Research Laboratories 635, Sasakura, Fuchu-machi, Toyama-sh, Toyama 53, 〒9392753, JP)
OKUNO, Takahisa (Materials Research Laboratories 635, Sasakura, Fuchu-machi, Toyama-sh, Toyama 53, 〒9392753, JP)
Application Number:
JP2019/017197
Publication Date:
November 07, 2019
Filing Date:
April 23, 2019
Export Citation:
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Assignee:
NISSAN CHEMICAL CORPORATION (5-1 Nihonbashi 2-chome, Chuo-ku Tokyo, 19, 〒1036119, JP)
International Classes:
H01L21/304; B32B7/06; B32B27/00; C09J5/04; C09J11/06; C09J183/05; C09J183/07; H01L21/02
Domestic Patent References:
WO2017221772A12017-12-28
WO2016181879A12016-11-17
Foreign References:
JP2013520009A2013-05-30
JP2012229333A2012-11-22
JP2012169573A2012-09-06
Attorney, Agent or Firm:
HANABUSA PATENT & TRADEMARK OFFICE (Shin-Ochanomizu Urban Trinity, 2 Kandasurugadai 3-chome, Chiyoda-k, Tokyo 62, 〒1010062, JP)
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