TEMPORARY ADHESIVE FOR SEMICONDUCTOR DEVICE PRODUCTION, ADHESIVE SUPPORTING BODY USING SAME, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING SAME

WIPO Patent Application WO/2013/187244

A1

Provided are: a temporary adhesive for semiconductor device production, which is capable of temporarily supporting a member to be processed (such as a semiconductor wafer) easily and reliably when the member to be processed is mechanically or chemically processed, and which enables easy removal of the temporary support from the processed member without damaging the processed member; and an adhesive supporting body and a method for producing a semiconductor device, each of which uses the temporary adhesive for semiconductor device production. A temporary adhesive for semiconductor device production, which contains (A) a polymer compound having an acid group, (B) a diluent and (C) a solvent; and an adhesive supporting body and a method for producing a semiconductor device, each of which uses this temporary adhesive for semiconductor device production.

JP5499772	Methods for manufacturing semiconductor adhesive members, semiconductor adhesive compositions, semiconductor adhesive films, laminates, and semiconductor devices
WO/2008/149745	BONDING METHOD, AND BIOCHEMICAL CHIP AND OPTICAL COMPONENT PRODUCED BY THE METHOD
JP6987427	Adhesive composition for semiconductor circuit connection and adhesive film containing it

FUJIMAKI KAZUHIRO (JP)
KOYAMA ICHIRO (JP)
NAKAMURA ATSUSHI (JP)
IWAI YU (JP)
TAN SHIRO (JP)

PCT/JP2013/065102

December 19, 2013

May 30, 2013

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FUJIFILM CORP (JP)

C09J201/02; C09J7/20; C09J7/38; C09J11/06; C09J133/00; C09J161/06; C09J175/04; H01L21/304; H01L23/12

JP2006111651A	2006-04-27
JP2000345131A	2000-12-12
JP2007056066A	2007-03-08

TAKAMATSU Takeshi et al. (JP)
Takamatsu 猛 (JP)

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