Title:
TEMPORARY ADHESIVE FOR SEMICONDUCTOR DEVICE PRODUCTION, ADHESIVE SUBSTRATE USING SAME, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2014/050455
Kind Code:
A1
Abstract:
Provided are: a temporary adhesive for semiconductor device production that contains (A) a polymer compound having a thermal decomposition temperature of at least 250°C, and (B) a radical polymerizable monomer; an adhesive substrate that uses the temporary adhesive for semiconductor device production; and a semiconductor device production method. The temporary adhesive for semiconductor device production, adhesive substrate that uses the temporary adhesive for semiconductor device production, and the semiconductor device production method: enable a member being processed (i.e., a semiconductor wafer or the like) to be temporarily supported by a strong adhesive force, even at a high temperature (for example, 100°C) when the member being processed is subjected to mechanical or chemical processing; enable a problem in which an adhesive generates gas to be reduced even when the member being processed is temporarily supported at a high temperature; and enable the temporary support of the member being processed to easily be terminated without damaging the member being processed.
Inventors:
IWAI YU (JP)
KOYAMA ICHIRO (JP)
KOYAMA ICHIRO (JP)
Application Number:
PCT/JP2013/073669
Publication Date:
April 03, 2014
Filing Date:
September 03, 2013
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C09J201/00; C09J4/00; C09J101/00; C09J125/04; H01L21/304
Domestic Patent References:
| WO2008018252A1 | 2008-02-14 |
Foreign References:
| JP2011219686A | 2011-11-04 | |||
| JP2007291394A | 2007-11-08 | |||
| JP2009242771A | 2009-10-22 |
Attorney, Agent or Firm:
TAKAMATSU Takeshi et al. (JP)
Takamatsu 猛 (JP)
Takamatsu 猛 (JP)
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