Title:
TEMPORARY FIXATION COMPOSITION, BONDED STRUCTURE MANUFACTURING METHOD, AND USE OF TEMPORARY FIXATION COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/048146
Kind Code:
A1
Abstract:
A temporary fixation composition according to the present invention comprises an organic component at a percentage of 42% by mass to 95% by mass inclusive, the organic component being solid at 25℃ and has a 95% mass reduction temperature in nitrogen of 300℃ or less. The temporary fixation composition is used for temporarily fixing a first to-be-bonded material to a second to-be-bonded material before the two materials are bonded together. A bonded structure manufacturing method according to the present invention comprises a step for interposing the temporary fixation composition between the first to-be-bonded material and the second to-be-bonded material to temporarily fix the two materials to each other, and then performing baking to bond the two temporarily fixed materials together.
Inventors:
ANAI KEI (JP)
NISHIKAWA JO (JP)
MATSUYAMA TOSHIKAZU (JP)
NISHIKAWA JO (JP)
MATSUYAMA TOSHIKAZU (JP)
Application Number:
PCT/JP2023/027334
Publication Date:
March 07, 2024
Filing Date:
July 26, 2023
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO LTD (JP)
International Classes:
H01L25/07; B22F1/10; B22F7/08; H01L25/18
Domestic Patent References:
| WO2017013808A1 | 2017-01-26 |
Foreign References:
| JP2000109787A | 2000-04-18 | |||
| JP2020109134A | 2020-07-16 |
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
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