Title:
TEMPORARY FIXATIVE AND METHOD FOR FINISHING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2012/081608
Kind Code:
A1
Abstract:
The present invention provides a temporary fixative with which it is possible to finish a substrate with high precision while damage to the substrate is minimized, and with which the substrate can be easily removed from a support substrate under a low heating temperature after finishing. The present invention also provides a method for finishing a substrate using the temporary fixative. The temporary fixative of the present invention is used by temporarily fixing a semiconductor wafer (3) (substrate) to a support substrate (1) in order to finish the semiconductor wafer (3), and, once the semiconductor wafer (3) has been finished, by exposing the product to active energy rays and then carrying out heating in order to remove the semiconductor wafer (3) from the support substrate (1).
Inventors:
KUBOYAMA TOSHIHARU (JP)
KAWATA MASAKAZU (JP)
TAKEUCHI ETSU (JP)
KUSUNOKI JUNYA (JP)
SUGIYAMA HIROMICHI (JP)
SATO TOSHIHIRO (JP)
KAWATA MASAKAZU (JP)
TAKEUCHI ETSU (JP)
KUSUNOKI JUNYA (JP)
SUGIYAMA HIROMICHI (JP)
SATO TOSHIHIRO (JP)
Application Number:
PCT/JP2011/078880
Publication Date:
June 21, 2012
Filing Date:
December 14, 2011
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
KUBOYAMA TOSHIHARU (JP)
KAWATA MASAKAZU (JP)
TAKEUCHI ETSU (JP)
KUSUNOKI JUNYA (JP)
SUGIYAMA HIROMICHI (JP)
SATO TOSHIHIRO (JP)
KUBOYAMA TOSHIHARU (JP)
KAWATA MASAKAZU (JP)
TAKEUCHI ETSU (JP)
KUSUNOKI JUNYA (JP)
SUGIYAMA HIROMICHI (JP)
SATO TOSHIHIRO (JP)
International Classes:
C09J201/00; C09J5/00; C09J11/06; C09J169/00; H01L21/304
Domestic Patent References:
| WO2011074520A1 | 2011-06-23 | |||
| WO2010147102A1 | 2010-12-23 | |||
| WO2010147103A1 | 2010-12-23 |
Foreign References:
| JP2005290146A | 2005-10-20 | |||
| JP2006504853A | 2006-02-09 | |||
| JP2004186263A | 2004-07-02 |
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
Sumio Tanai (JP)
Sumio Tanai (JP)
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Claims: