Title:
TEMPORARY-FIXING SUBSTRATE AND METHOD FOR MOLDING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/179819
Kind Code:
A1
Abstract:
A temporary-fixing substrate 2 provided with: a fixing surface 1A for adhering a plurality of electronic components 6 and temporarily fixing the plurality of electronic components 6 using a resin mold 7; and a bottom surface 3B disposed on the opposite side from the fixing surface. The temporary-fixing substrate 2 comprises a light transmissive ceramic, scratches are dispersed over the fixing surface 1A, and a polished surface and a grain boundary of crystal particles constituting the light transmissive ceramic are exposed on the bottom surface. The bottom surface has a scratch density lower than a scratch density on the fixing surface.
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Inventors:
NOMURA MASARU (JP)
MIYAZAWA SUGIO (JP)
MIYAZAWA SUGIO (JP)
Application Number:
PCT/JP2018/003404
Publication Date:
October 04, 2018
Filing Date:
February 01, 2018
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
International Classes:
H01L21/02; H01L21/56
Domestic Patent References:
| WO2013187410A1 | 2013-12-19 |
Foreign References:
| JP2003078069A | 2003-03-14 |
Attorney, Agent or Firm:
HOSODA Masutoshi et al. (JP)
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