Title:
TEMPORARY PROTECTION FILM FOR PRODUCTION OF SEMICONDUCTOR DEVICE AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/233970
Kind Code:
A1
Abstract:
A temporary protection film for production of a semiconductor device, comprising: a support film; and an adhesive layer provided on the support film, wherein the adhesive layer contains a polymer including, as monomer units, alkyl(meth)acrylate, (meth)acryloylmorpholine, and a monomer having a crosslinkable group, and a crosslinking agent that is crosslinkable with the crosslinkable group, and the contained amount of (meth)acryloylmorpholine is at least 7 mass% with respect to the total amount of the monomer units in the polymer.
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Inventors:
ITO KODAI (JP)
Application Number:
PCT/JP2023/017970
Publication Date:
December 07, 2023
Filing Date:
May 12, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
H01L21/56; C09J7/38; C09J11/06; C09J133/06; C09J133/14; H01L21/02; H01L23/29; H01L23/31
Foreign References:
| JPH09310050A | 1997-12-02 | |||
| JP2021097076A | 2021-06-24 | |||
| JP2013170197A | 2013-09-02 | |||
| JP2008131006A | 2008-06-05 | |||
| JP2006013062A | 2006-01-12 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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