Title:
TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR SEALING MOLDING
Document Type and Number:
WIPO Patent Application WO/2018/207408
Kind Code:
A1
Abstract:
Disclosed is a temporary protective film which is for semiconductor sealing molding 10 and is provided with: a supporting film 1; and adhesive layer 2 provided on the support film 1 and containing an acrylic rubber. The solid shear modulus of elasticity of the temporary protective film for semiconductor sealing molding 10 at 200°C of may be 5.0 Mpa or more.
Inventors:
TOMORI NAOKI (JP)
NAGOYA TOMOHIRO (JP)
NAGOYA TOMOHIRO (JP)
Application Number:
PCT/JP2018/002313
Publication Date:
November 15, 2018
Filing Date:
January 25, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L21/56; B32B7/02; B32B7/12; B32B25/08; B32B27/00; B32B27/30; B32B27/34; C09J7/20; C09J133/00; H01L23/50
Foreign References:
| JP2008131006A | 2008-06-05 | |||
| JP2009044010A | 2009-02-26 | |||
| JP2005116919A | 2005-04-28 | |||
| JP2003086614A | 2003-03-20 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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