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Title:
TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR SEALING MOLDING, LEAD FRAME WITH TEMPORARY PROTECTIVE FILM, SEALED MOLDED BODY WITH TEMPORARY PROTECTIVE FILM, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/176597
Kind Code:
A1
Abstract:
Disclosed is a temporary protective film for semiconductor sealing molding, which is provided with a support film and an adhesive layer that is provided on one surface or both surfaces of the support film. The linear expansion coefficient of this temporary protective film for semiconductor sealing molding for the range from 30°C to 200°C may be from 16 ppm/°C to 20 ppm/°C (inclusive) in at least one in-plane direction of this temporary protective film for semiconductor sealing molding.

Inventors:
TOMORI NAOKI (JP)
NAGOYA TOMOHIRO (JP)
KURODA TAKAHIRO (JP)
Application Number:
JP2019/008212
Publication Date:
September 19, 2019
Filing Date:
March 01, 2019
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L21/56; B32B7/027; B32B27/00; C08G73/14; C09J7/25; C09J7/30; C09J201/00; C09J201/02; H01L23/50
Domestic Patent References:
WO2004075293A12004-09-02
Foreign References:
JP2012059846A2012-03-22
JP2013040276A2013-02-28
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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