Title:
TERMINAL CONNECTION STRUCTURE AND ELECTROMAGNETIC RELAY USING SAME
Document Type and Number:
WIPO Patent Application WO/2016/167050
Kind Code:
A1
Abstract:
Provided is a terminal connection structure which exhibits a favorable material yield rate, is highly producible, and does not cause mounting failures. To this end, the present invention comprises: a base (10) having a terminal hole (11), a fixed contact terminal part (13), a through-hole (15) that extends along the axial center of the fixed contact terminal part (13) and connects to the terminal hole (11), and a conductive film (17) formed continuously along the inner-circumferential surface of the terminal hole (11), the inner-circumferential surface of the through-hole (15), and the exposed surface of the fixed contact terminal part (13); and a contact part that is pressed into the terminal hole (11) and is electrically connected to the fixed contact terminal part (13) via the conductive film (17).
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Inventors:
SHIMODA SEIKI (JP)
ABE MASAAKI (JP)
ABE MASAAKI (JP)
Application Number:
PCT/JP2016/057152
Publication Date:
October 20, 2016
Filing Date:
March 08, 2016
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
H01H50/02; H01R31/06; H01R13/03
Foreign References:
| JP2000500907A | 2000-01-25 | |||
| JPH04278597A | 1992-10-05 | |||
| JP2009004284A | 2009-01-08 |
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
Mutsumi Sameshima (JP)
Mutsumi Sameshima (JP)
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