Title:
TERMINAL CONNECTION STRUCTURE FOR POWER SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2016/204306
Kind Code:
A1
Abstract:
This terminal connection structure for a power semiconductor module connects an electrical power cable to a power semiconductor module 10 having a pin output terminal 2 erected on a side edge part of an upper surface. The terminal connection structure is provided with: a resin bracket 4 in which an insert nut 13 exposed on an upper surface and used for fixing a connection terminal 31 of the electrical power cable is inserted; and a bushing-attached connection substrate 5 having a terminal hole 16 formed therein through which the pin output terminal 2 passes, and having a conductive bushing 15 through which a bolt 18 that is screwed to the insert nut 13 passes, wherein the pin output terminal 2 is inserted through the terminal hole 16 and soldered, and the connection terminal 31 is sandwiched between the conductive bushing 15 and the head part of the fixing bolt 18 and fastened by the fixing bolt 18, whereby the electrical cable is connected to the power semiconductor module 10.
Inventors:
TSUCHIYA JUNICHIROU (JP)
KATO YUICHI (JP)
SOUDA AKIHIKO (JP)
KATO YUICHI (JP)
SOUDA AKIHIKO (JP)
Application Number:
PCT/JP2016/072164
Publication Date:
December 22, 2016
Filing Date:
July 28, 2016
Export Citation:
Assignee:
KOMATSU MFG CO LTD (JP)
International Classes:
H01L25/07; H01L25/18; H02M7/48
Foreign References:
JP2012227038A | 2012-11-15 | |||
JPS5482353U | 1979-06-11 | |||
JP2013235757A | 2013-11-21 | |||
JP2009289734A | 2009-12-10 | |||
JPH0621161U | 1994-03-18 | |||
JPS60121665U | 1985-08-16 | |||
JP2011198817A | 2011-10-06 | |||
JP2005183644A | 2005-07-07 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
Patent business corporation Sakai international patent firm (JP)
Patent business corporation Sakai international patent firm (JP)
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