Title:
TERMINAL MATERIAL FOR CONNECTOR
Document Type and Number:
WIPO Patent Application WO/2021/166581
Kind Code:
A1
Abstract:
A terminal material for a connector, the terminal material comprising a substrate in which at least a surface layer thereof comprises copper or a copper alloy, a nickel plating layer that comprises nickel or a nickel alloy and is formed on the surface of the substrate, a silver-nickel alloy plating layer that comprises a silver-nickel alloy and is formed on at least a portion of the nickel plating layer, and a silver plating layer that comprises silver and is formed on the silver-nickel alloy plating layer, the film thickness of the silver-nickel alloy plating layer being at least 0.05 µm and less than 0.50 µm, and the nickel content of the silver-nickel alloy plating layer being 0.03-1.00 at% (inclusive).
Inventors:
TARUTANI YOSHIE (JP)
KUBOTA KENJI (JP)
KATOU NAOKI (JP)
KUBOTA KENJI (JP)
KATOU NAOKI (JP)
Application Number:
PCT/JP2021/003053
Publication Date:
August 26, 2021
Filing Date:
January 28, 2021
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C25D7/00; C25D3/12; C25D3/46; C25D3/64; C25D5/12
Foreign References:
| JP2018104776A | 2018-07-05 | |||
| JP2008270192A | 2008-11-06 | |||
| JP2016065316A | 2016-04-28 | |||
| JP2020027614A | 2020-02-20 | |||
| JP2007177329A | 2007-07-12 | |||
| JP2015117424A | 2015-06-25 |
Other References:
See also references of EP 4108811A4
Attorney, Agent or Firm:
AOYAMA, Masakazu (JP)
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