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Patent Searching and Data


Title:
TERMINAL STRUCTURE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2023/100520
Kind Code:
A1
Abstract:
The purpose of the present invention is to reduce the possibility of occurrence of dielectric breakdown between terminals. In this terminal structure, a plurality of terminals 10 are electrically conductively connected, through soldering, to a plurality of electric wires 4 and are disposed on a terminal installation surface 2b of a terminal block, and resin-molding is performed so as to surround the terminals together with the electric wires, thereby ensuring the insulation property. The terminals are each configured such that: an end part 10u side is set for a soldering region 10a of a corresponding electric wire; and an opening 13, which is for restricting a molten solder 5m from extending from the soldering region to the adjacent terminal installation surface 2b side, is formed.

Inventors:
ANAI DAISUKE (JP)
TAKIMOTO KAZUYA (JP)
Application Number:
PCT/JP2022/039190
Publication Date:
June 08, 2023
Filing Date:
October 20, 2022
Export Citation:
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Assignee:
SAGINOMIYA SEISAKUSHO INC (JP)
International Classes:
H01R4/02; H01R4/70; H01R9/16; H01R43/02; H01R43/24
Foreign References:
JPH07318573A1995-12-08
JPS49150687U1974-12-26
JPS49106886U1974-09-12
JP2001257444A2001-09-21
JPH10247535A1998-09-14
JPS57174879A1982-10-27
JPS62229675A1987-10-08
Attorney, Agent or Firm:
TANI & ABE, P.C. (JP)
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