Title:
TERMINAL STRUCTURE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2023/100520
Kind Code:
A1
Abstract:
The purpose of the present invention is to reduce the possibility of occurrence of dielectric breakdown between terminals. In this terminal structure, a plurality of terminals 10 are electrically conductively connected, through soldering, to a plurality of electric wires 4 and are disposed on a terminal installation surface 2b of a terminal block, and resin-molding is performed so as to surround the terminals together with the electric wires, thereby ensuring the insulation property. The terminals are each configured such that: an end part 10u side is set for a soldering region 10a of a corresponding electric wire; and an opening 13, which is for restricting a molten solder 5m from extending from the soldering region to the adjacent terminal installation surface 2b side, is formed.
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Inventors:
ANAI DAISUKE (JP)
TAKIMOTO KAZUYA (JP)
TAKIMOTO KAZUYA (JP)
Application Number:
PCT/JP2022/039190
Publication Date:
June 08, 2023
Filing Date:
October 20, 2022
Export Citation:
Assignee:
SAGINOMIYA SEISAKUSHO INC (JP)
International Classes:
H01R4/02; H01R4/70; H01R9/16; H01R43/02; H01R43/24
Foreign References:
JPH07318573A | 1995-12-08 | |||
JPS49150687U | 1974-12-26 | |||
JPS49106886U | 1974-09-12 | |||
JP2001257444A | 2001-09-21 | |||
JPH10247535A | 1998-09-14 | |||
JPS57174879A | 1982-10-27 | |||
JPS62229675A | 1987-10-08 |
Attorney, Agent or Firm:
TANI & ABE, P.C. (JP)
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