AND RELATED METHODS

PRIORITY APPLICATION

This application claims priority to United States Provisional Application Number 62/611,853 that was filed on December 29, 2017. The entire content of the application referenced above is hereby incorporated by reference herein.

TECHNICAL FIELD

Test contactor assemblies and related methods.

TECHNICAL BACKGROUND

Test contactors are used on printed circuit boards to test various parameters and/or components of semiconductor devices. Electronic devices have become smaller yet more powerful, resulting crowded and complex circuit boards. For example, modern automobiles are using RADAR equipment for collision avoidance, parking assist, automated driving, cruise control, etc. The radio frequencies used in such systems are typically 76 - 81 GHz (W-band). Also, the radio frequencies used for wifi applications are in the range of 56 - 64 GHz. Next generation IC's will push operating frequencies to even higher levels, for example in the cellular market space. Semiconductor devices that operate at these frequencies need to be tested, but existing test contactor technology cannot operate in the W-band due to extreme transmission line impedance mismatches, and high loss. Even well matched contactor technologies need traditional PCB transitions and RF connectors that create additional loss and inhibit mmWave signals from reaching the device under test (DUT). The technology described herein

incorporates waveguide transitions into the contactor allowing the least amount of loss possible from test instrument to DUT through contacted and non-contacted means.

SUMMARY

In one or more embodiments, the test socket assembly described herein includes a waveguide embedded within a semiconductor device socket assembly and a coplanar waveguide (CPW) to rectangular waveguide transition within the test socket assembly, for example for E- band (60 - 90 GHz) mmWave applications.

In one or more embodiments, a test socket assembly described herein incorporates a

CPW to rectangular waveguide transition at an interface between the test socket assembly and a test instrument. The rectangular waveguide can be a waveguide block having an optional waveguide flange.

In one or more embodiments, a test socket assembly includes a contactor body, the contactor body having a socket opening sized and configured to receive a device under test therein. A lead frame assembly is disposed within the contactor body, the lead frame assembly includes at least a portion of a waveguide transition. At least one transmission line is disposed within the lead frame assembly, the at least one transmission line configured to communicate to the device under test when the device under test is disposed within the socket opening, and the at least one transmission line has a termination end. One or more rectangular waveguides are at least partially disposed within the contactor body or external to the contactor body, and the waveguide transition is configured to provide a transition between the at least one transmission line and the rectangular waveguide, the waveguide transition disposed within the contactor body and the at least one transmission line connects the device under test with the rectangular waveguide.

In one or more embodiments, the at least one transmission line is a co-planar waveguide.

In one or more embodiments, the at least one transmission line is a microstrip.

In one or more embodiments, wherein the waveguide transition includes a backshort.

In one or more embodiments, the waveguide transition includes a termination end.

In one or more embodiments, the at least one transmission line includes a coaxial transmission line near the termination end of the at least one transmission line.

In one or more embodiments, the waveguide transition is an antenna that extends into the rectangular waveguide.

In one or more embodiments, at least one of the one or more antennas is a rectangular shaped structure.

In one or more embodiments, the contactor body includes one or more radiation openings adjacent to the termination end of the at least one transmission line, the one or more radiation openings configured to allow transmission of a wireless signal.

In one or more embodiments, the one or more rectangular waveguides includes electric field plane bends.

In one or more embodiments, the one or more rectangular waveguides includes magnetic field bends.

In one or more embodiments, the one or more rectangular waveguides are formed of two or more independent parts, one part of the one or more rectangular waveguides is within a top metal socket frame. In one or more embodiments, the test socket assembly further includes a first device under test disposed with the socket opening.

In one or more embodiments, a test socket assembly includes a contactor body, the contactor body having a socket opening sized and configured to receive a device under test therein. A lead frame assembly is disposed adjacent to the contactor body, the lead frame assembly having a waveguide transition therein, and the waveguide transition includes a lead extending from the lead frame assembly. The test socket assembly further includes at least one socket frame, and at least one coplanar waveguide within the lead frame assembly. The coplanar waveguide is configured to communicate to the device under test when the device under test is disposed within the socket opening. One or more rectangular waveguides area at least partially external to the contactor body, and the waveguide transition is disposed between the rectangular waveguide and the coplanar waveguide, where the waveguide transition is disposed within the contactor body.

In one or more embodiments, the test socket assembly further includes a top socket frame disposed adjacent to the lead frame assembly, the lead frame assembly disposed between the top socket frame and the contactor body, wherein the top socket frame comprises a back short disposed adjacent to the lead frame assembly.

In one or more embodiments, the back short has a back short cavity therein, and the back short cavity is adjacent to the waveguide transition.

In one or more embodiments, the waveguide transition includes a backshort and a termination end.

In one or more embodiments, the waveguide transition is an antenna that extends adjacent to an end of the rectangular waveguide.

In one or more embodiments, the test socket assembly further includes a waveguide component.

In one or more embodiments, the coplanar waveguide further includes a coaxial transmission line near the waveguide transition.

In one or more embodiments, a method for testing components includes disposing a device under test in a test socket assembly, the test socket assembly including a contactor body, the contactor body having a socket opening sized and configured to receive the device under test therein, a lead frame assembly disposed within the contactor body, the lead frame assembly having at least a portion of a waveguide transition. At least one transmission line is disposed within the lead frame assembly, where the at least one transmission line configured to communicate to the device under test when the device under test is disposed within the socket opening. The at least one transmission line has a termination end, one or more rectangular waveguides are at least partially disposed within the contactor body or external to the contactor body, and the waveguide transition is disposed between the rectangular waveguide and the at least one transmission line. The waveguide transition is configured to provide a transition between the at least one transmission line and the rectangular waveguide, and the waveguide transition is disposed within the contactor body.

The method further includes connecting the device under test with the at least one transmission line, and sending signals to the device under test with the one or more rectangular waveguides, and the device under test receives the signals.

In one or more embodiments, a coplanar waveguide is provided from a DUT side to a WR12 waveguide in a test socket assembly. This can be optimized for different frequency ranges using different waveguide dimensions. In one example, the coplanar waveguide section is about 20 mm in length, and the rectangular waveguide section is about 60 mm in length. In one or more embodiments, where designed for a frequency range from 76 GHz to 81 GHz, the insertion loss is -1.2 dB max, and the return loss is about -20 dB max. The coplanar waveguide was made shorter and the rectangular waveguide longer to reduce the total path loss.

These and other embodiments, aspects, advantages, and features of the present invention will be set forth in part in the description which follows, and will become apparent to those skilled in the art by reference to the following description of the invention and referenced drawings or by practice of the invention. The aspects, advantages, and features of the invention are realized and attained by means of the instrumentalities, procedures, and combinations particularly pointed out in the appended claims and their equivalents.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 A illustrates a perspective view of a test socket assembly as constructed in one or more embodiments.

FIG. 1B illustrates an exploded perspective view of a test socket assembly as constructed in one or more embodiments.

FIG. 1C illustrates an exploded perspective view of a test socket assembly as constructed in one or more embodiments.

FIG. 1D illustrates an exploded perspective view of a test socket assembly as constructed in one or more embodiments.

FIG. 1E illustrates a top view of a lead frame assembly as constructed in one or more embodiments.

FIG. 2 illustrates a perspective top view of a test socket assembly as constructed in one or more embodiments. FIG. 3 illustrates a perspective bottom view of a test socket assembly as constructed in one or more embodiments.

FIG. 4 illustrates a perspective view of a test socket assembly as constructed in one or more embodiments.

FIG. 5 illustrates a perspective view of a test socket assembly as constructed in one or more embodiments.

FIG. 6 illustrates a perspective view of a test socket assembly as constructed in one or more embodiments.

FIG. 7 illustrates a cross-sectional view of a test socket assembly as constructed in one or more embodiments.

FIG. 8 illustrates a cross-sectional view of a portion of a test socket assembly as constructed in one or more embodiments.

FIG. 9 illustrates a cross-sectional view of the back short in a socket frame of a test socket assembly as constructed in one or more embodiments.

FIG. 10 illustrates an enlarged view of FIG. 9.

FIG. 11 illustrates a top view of a portion of a lead frame assembly as constructed in one or more embodiments.

FIG. 12 illustrates a cross-sectional view a test socket assembly with a manual test as constructed in one or more embodiments.

FIG. 13 illustrates a cross-sectional view a test socket assembly with a handler test as constructed in one or more embodiments.

FIG. 14 illustrates a cross-sectional view of a test socket assembly with vertical rectangular waveguide embedded in socket as constructed in one or more embodiments.

FIG. 15 illustrates a side view of a back short as constructed in one or more embodiments.

FIG. 16 illustrates a bottom view of a back short as constructed in one or more

embodiments.

FIG. 17 illustrates an exploded side view of a test socket assembly as constructed in one or more embodiments.

FIG. 18 illustrates a view of a lead frame assembly as constructed in one or more embodiments.

FIG. 19 illustrates a perspective view of a test socket assembly as constructed in one or more embodiments.

FIG. 20 illustrates a perspective view of a rectangular waveguide as constructed in one or more embodiments. FIG. 21 illustrates a perspective view of a rectangular waveguide and coplanar waveguide as constructed in one or more embodiments.

FIG. 22 illustrates a perspective view of a rectangular waveguide and coplanar waveguide transition as constructed in one or more embodiments.

FIG. 23 illustrates an enlarged perspective view of a rectangular waveguide as constructed in one or more embodiments.

FIG. 24 illustrates a perspective view of a DETT and tester transitions as constructed in one or more embodiments.

FIG. 25 illustrates a perspective view of a rectangular waveguide and coplanar waveguide path in a test socket assembly as constructed in one or more embodiments.

FIG. 26 illustrates a perspective view of a wave guide transition as constructed in one or more embodiments.

FIG. 27 illustrates a cross-section of a waveguide as constructed in one or more embodiments.

FIG. 28 illustrates a perspective view of a tester transition as constructed in one or more embodiments.

DETAILED DESCRIPTION

The following detailed description includes references to the accompanying drawings, which form a part of the detailed description. The drawings show, by way of illustration, specific embodiments in which the apparatus may be practiced. These embodiments, which are also referred to herein as“examples” or“options,” are described in enough detail to enable those skilled in the art to practice the present embodiments. The embodiments may be combined, other embodiments may be utilized or structural or logical changes may be made without departing from the scope of the invention. The following detailed description is, therefore, not to be taken in a limiting sense and the scope of the invention is defined by the appended claims and their legal equivalents.

In this document, the terms“a” or“an” are used to include one or more than one, and the term“or” is used to refer to a nonexclusive“or” unless otherwise indicated. In addition, it is to be understood that the phraseology or terminology employed herein, and not otherwise defined, is for the purpose of description only and not of limitation.

A test socket assembly 100 with one or more waveguides embedded therein, and the coplanar waveguide (CPW) to rectangular waveguide transition disposed within the test socket assemblies. In one or more embodiments, a test socket assembly described herein incorporates a

CPW to rectangular waveguide transition at an interface between the test socket assembly and a test instrument. The rectangular waveguide can be a waveguide block having an optional waveguide flange. In one or more embodiments, the test socket assembly 100 communicates via waveguides and optionally via probes with the device under test 200 in a hybrid arrangement. The test socket assembly 100 allows direct communication between test hardware and the device under test while optionally maintaining a contacted spring probe interface for remaining standard inputs and outputs on a BGA/QFN/WLCSP, or any other packaging technology. The test socket assembly 100 can include probes and lead frames and other features as described in US2015/0369840, which is incorporated herein by reference in its entirety.

FIG. 2 illustrates a test socket assembly 100 with a contactor on the side which receives the device under test (DUT), and FIG. 3 shows the same side without the contactor. FIG. 4 illustrates also the DUT side, but with the lead frame assembly 140 exposed. FIG. 5 illustrates the tester side of the test socket assembly 100, where the test socket assembly 100 would interface with a tester.

In one or more embodiments, a waveguide is embedded within a semiconductor device test socket and a coplanar waveguide (CPW) to rectangular waveguide transition is disposed within a test socket assembly for E-band (60 - 90 GHz) mmWave applications. In one or more embodiments, an E-plane signal probe extending from a CPW lead frame assembly extends into a rectangular waveguide, all of which is embedded within test socket assembly. The rectangular waveguide is built with two pieces of metal with symmetrical cut through the center of E-plane of waveguide. The CPW to waveguide transition further optionally incorporates a short length of coaxial transmission line and a rectangular center conductor. The proposed CPW-to-rectangular waveguide transition and waveguide E-plane banding can provide 10 GHz bandwidth in E-band.

In one or more embodiments, a waveguide is embedded within a semiconductor device test socket assembly, and a waveguide transition between a coplanar waveguide and a rectangular waveguide is at an interface between the contactor and the test instrument. This implementation does not include the rectangular waveguide in the contactor but instead interfaces with a waveguide block having either a standard or a custom waveguide flange. This implementation incorporates standard rectangular waveguides, but the transition was optimized for the unique lead frame coplanar waveguide architecture.

In one or more embodiments the test socket assembly 100 generally includes contactor body 190, a lead frame assembly 140, spring probes 120, a printed circuit board 152, a socket frame 160, and an optional back short 170.

The test socket assembly 100 is used with a device under test 200 (FIG. 19). Referring to FIG. 2, a socket opening 192 within the contactor body receives the device under test 200 therein and assists in aligning the device under test 200 with the test socket assembly 100. The socket opening 192 is sized and configured to receive the device under test 200 therein. The lead frame assembly 140 communicates with the device under test via the DUT end 145 of the lead frame assembly 140 (FIG. 7), as further described below. The test socket assembly 100 communicates with the tester via a tester interface 118, such as a waveguide component 122 (FIGs. 4, 5) or a rectangular waveguide 180 (FIG. 28).

FIGs. 2 - 18 illustrate the test socket assembly 100 in greater detail. The test socket assembly 100 includes a contactor body 190 and a lead frame assembly 140 disposed within the contactor body 190. The lead frame assembly 140, as shown in FIG. 1E includes at least one transmission line 142 within the lead frame assembly 140. While one transmission line 142 is shown, multiple transmission lines can be provided. In one or more embodiments, there are about 2 - 18 transmission lines. The at least one transmission line 142 is configured to communicate to the device under test, for example, when the device under test is disposed within the socket opening 192 (FIGs. 7, 20). In one or more embodiments, the at least one transmission line 142 is a co-planar waveguide 132 (FIG. 7). In one or more embodiments, the at least one transmission line 142 is a microstrip 133. The at least one transmission line 142 extends from a DUT end 145 to a termination end 148. The DUT end 145 interfaces with the device under test (DUT), for example a device under test disposed in the socket. The termination end 148 serves as part of the waveguide transition 144, which transitions to a rectangular waveguide 180.

The test socket assembly includes the lead frame assembly 140 and optionally one or more spring probes 120. The lead frame assembly 140 is disposed within the contactor body 190, and is electrically coupled with the one or more spring probes 120, which are also disposed within the contactor body 190. The lead frame assembly 140 is further electrically coupled with the one or more rectangular waveguide 180.

The lead frame assembly 140 further includes a substrate disposed thereon, although there is no substrate on the termination end 148. The lead frame assembly 140 is sandwiched between the contactor body 190, where it is received within the contactor body 190, and the metal socket frame 160. The metal socket frame 160 and the contactor body 190 includes a pocket 194 therein, as shown in FIGs. 1B, 1D. The path of the pocket 194 follows along the path of the coplanar waveguide 132 to provide a gap of air around the at least one transmission line 142, where the air gap is above and below the at least transmission line 142.

The metal socket frame 160, in one or more embodiments, includes a top socket frame

161 and a bottom socket frame 162. The metal socket frame 160 forms the rectangular waveguide 180 therein, as shown in FIGs. 1B - 1D. The rectangular waveguide 180 can be formed in the metal socket frame 160 for example, by making the metal socket frame 160 a two piece machined metal body. The two pieces are machined with the rectangular waveguide 180 shape, and brought together along cut line 186 (FIG. 23). One part of the rectangular waveguide 180 is in the top socket frame 161, and another part of the rectangular waveguide 180 is formed in the bottom socket frame 162. In one or more embodiments, the metal socket frame 160 with rectangular waveguide 180 therein is formed as a single, unitary piece, for example, by 3D printing.

Referring to FIGs. 20, 23, the rectangular waveguide 180 includes one or more electric field plane bends 182, and/or the rectangular waveguide 180 includes one or more magnetic field plane bends 184. In one or more embodiments, the rectangular waveguide 180 is a straight, linear waveguide, as shown in FIG. 8.

The one or more rectangular waveguide 180 is disposed within the test socket assembly 100. The one or more rectangular waveguides 180 can be at least partially or fully disposed within the contactor body 190 (FIG. 20), or external to the contactor body 190 (see FIG. 8).

The test socket assembly 100 further includes a waveguide transition 144, which forms part of the lead frame assembly 140, and is disposed within the test socket assembly 100, such as within the contactor body 190. The waveguide transition 144 is configured to provide a transition between the at least one transmission line 142 and the rectangular waveguide 180. In one or more embodiments, the waveguide transition 144 is configured to provide a transition between the at least one coplanar waveguide 132 and the rectangular waveguide 180. In one or more embodiments, the waveguide transition 144 includes one or more of a backshort 170, a termination end 148, a coaxial transmission line near the termination end of the at least one transmission line, or an antenna that extends into the rectangular waveguide.

FIGs. 21, 22, and 25 show the waveguide and coplanar waveguide path in greater detail. A signal from the DUT comes in at the DUT interface 210 at the DUT end 145 of the lead frame assembly 140. The DUT end 145 is at the end of the coplanar waveguide 132 of the lead frame assembly 140, where the coplanar waveguide 132 is surrounded by an air gap. The coplanar waveguide 132 transitions to the rectangular waveguide 180 within the test socket assembly 100, and, in an option, within the contactor body 190 at a waveguide transition 144. The rectangular waveguide 180, extends through the metal socket frame 160 with electric field plane bends 182, and a magnetic field plane bend 184, and terminates at a tester interface 118 (FIGs. 25, 28).

Referring again to the waveguide transition 144, the lead frame assembly 140 includes the transmission line 142 which extends to a termination end 148. The transmission line 142 is part of a coplanar waveguide 132, and transitions to a coaxial transmission line 134 near the termination end 148 (FIG. 18). At the termination end 148 is the probe that is inserted into the rectangular waveguide 180, and forming the waveguide transition 144, as shown in FIG. 21, 22,

25. In one or more embodiments, the end of the transmission line 142 includes an antenna 155, for example having a rectangular shape, as shown in FIG. 18. The rectangular shape assists in providing improved radiation of the energy into the rectangular waveguide. In one or more embodiments, the contactor body 190 includes one or more radiation openings adjacent to the termination end of the at least one transmission line, where the one or more radiation openings are configured to allow transmission of a wireless signal.

The termination end 148 is disposed at an end or within the rectangular waveguide 180 to radiate the signal therein, allowing for the transition between the coplanar waveguide 132 to the rectangular waveguide 180. In one or more embodiments, there is a gap surrounding the transmission line 130 just prior to entering the rectangular waveguide 180, as shown in FIGs. 22,

26. In one or more embodiments, the at least one transmission line 130 enters the rectangular waveguide 180 such that the longitudinal axis of the at least one transmission line 130 is perpendicular to the rectangular waveguide 180, shown in FIG 8, for example when the rectangular waveguide 180 is in a vertical plane. The plane of the leadframe assembly 140 is perpendicular to the rectangular waveguide 180. In one or more embodiments, the at least one transmission line 130 enters the rectangular waveguide 180 such that the plane of the lead frame assembly 140 is horizontal to the WR12 H plane, shown in FIG. 20.

In one or more embodiments, the waveguide transition includes a backshort 170. In one or more embodiments, the backshort 170 is the metal socket frame 160 having a back short cavity 172 therein. (FIGs. 9 and 10). In one or more embodiments, the backshort cavity 172 is a pocket milled into the top socket frame. In one or more embodiments, the depth of the pocket is optimized to minimize loss in transition from the coplanar waveguide to the rectangular waveguide. FIGs. 15, 17 22. FIG. 15 is an example of a backshort 170 for FIG. 14, showing a side view of the backshort 170. In one or more embodiments, the backshort 170 is milled down so that the transmission line without shorting the DUT.

In one or more embodiments, as shown in FIG. 14, a vertical rectangular waveguide 180 is disposed within the test socket assembly 100. The transition 144 to the lead frame assembly 140, and to the coplanar waveguide 132 is also disposed within the test socket assembly 100.

The backshort 170 can be integral to the top socket frame 161 or can be independent.

FIGS. 12 and 13 illustrate additional embodiments for the test socket assembly 100.

FIG. 12 shows a rectangular waveguide 180 that comes through the top socket frame 161 and terminates to the lead frame assembly 140. In FIG. 13, which shows a handler test, a rectangular wave guide is below the daughter card 139 into the test socket assembly 100. The waveguide 180 comes in from underneath and comes through a stiffener 137, and would terminate on the lead frame assembly 140.

In one or more embodiments, the device under test 200 (FIG. 19) engages the spring probes 120 (FIG. 7) and communicates with the device under test. The device under test is further coupled with the DUT end 145 of the transmission line. In one or more embodiments, the test socket assembly 100 uses vertical compliance to achieve reliability. The spring probes 120 are compliant for the power, ground and low speed signal connections, such as balls. The microwave structures of the lead frame assembly 140 terminate in precision coaxial connectors or waveguides.

In one or more embodiments, the lead frame microwave structures are terminated externally to precision microwave connectors at a tester interface 118, such as a waveguide component 122. (FIG. 3). The following is a method for using the test socket assembly. In one or more embodiments, a method for testing components includes disposing a device under test in a test socket assembly, the test socket assembly including a contactor body, the contactor body having a socket opening sized and configured to receive the device under test therein, a lead frame assembly disposed within the contactor body, the lead frame assembly having at least a portion of a waveguide transition. At least one transmission line is disposed within the lead frame assembly, where the at least one transmission line configured to communicate to the device under test when the device under test is disposed within the socket opening. The at least one transmission line has a termination end, one or more rectangular waveguides at least partially disposed within the contactor body or external to the contactor body, and the waveguide transition is disposed between the rectangular waveguide and the at least one transmission line. The waveguide transition is configured to provide a transition between the at least one transmission line and the rectangular waveguide, and the waveguide transition is disposed within the contactor body.

The method further includes connecting the device under test with the at least one transmission line, and sending signals to the device under test with the one or more rectangular waveguides, and the device under test receives the signals.

In one or more embodiments, the method further includes sending low speed signals to the device under test via one or more spring probes. In one or more embodiments, a coplanar waveguide is provided from a DUT side to a WR12 waveguide in a test socket assembly. This can be optimized for different frequency ranges using different waveguide dimensions. In one example, the coplanar waveguide section is about 20 mm in length, and the rectangular waveguide section is about 60 mm in length. In one or more embodiments, where designed for a frequency range from 76 GHz to 81 GHz, the insertion loss is -1.2 dB max, and the return loss is about -20 dB max. The coplanar waveguide was made shorter and the rectangular waveguide longer to reduce the total path loss.

The test socket assembly described and shown herein is a test socket that is compatible with semiconductor back-end manufacturing, yet is capable in operating at the W-band frequencies. The spring probes provide for reliable testing at low speed frequencies and are combined with antennas to wirelessly communicate with antennas within the device under test. The waveguide transitions are incorporated into the contactor, allowing a lesser amount of loss from a test instrument to the DUT through contacted and non-contacted means.

It is to be understood that the above description is intended to be illustrative, and not restrictive. Many other embodiments will be apparent to those of skill in the art upon reading and understanding the above description. It should be noted that embodiments discussed in different portions of the description or referred to in different drawings can be combined to form additional embodiments of the present application. The scope should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.