Title:
TEST SOCKET HAVING HIGH-DENSITY CONDUCTIVE UNIT, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2013/151316
Kind Code:
A1
Abstract:
The present invention relates to a test socket having a high-density conductive unit, and to a method for manufacturing same, and more particularly, to a test socket interposed between a device to be tested and a test device so as to electrically connect a terminal of the device to be tested to a pad of the test device. The test socket of the present invention comprises: an elastic conductive sheet arranged at a position corresponding to the terminal of the device to be tested, and including a first conductive unit in which multiple first conductive particles are arranged in the thickness direction in an elastic material and an insulating support unit for supporting the first conductive unit and insulating the first conductive unit from an adjacent first conductive unit; a support sheet attached to at least either an upper surface or a lower surface of the elastic conductive sheet, and having through-holes formed in every point corresponding to the terminal of the device to be tested; and a second conductive unit which is arranged in the through-holes of the support sheet and in which multiple second conductive particles are arranged in the thickness direction in an elastic material. The second conductive particles are more densely arranged in the elastic material than the first conductive particles.
Inventors:
LEE JAE HAK (KR)
Application Number:
PCT/KR2013/002748
Publication Date:
October 10, 2013
Filing Date:
April 03, 2013
Export Citation:
Assignee:
LEE JAE HAK (KR)
International Classes:
G01R1/067; G01R31/26; H01R11/01; H01R33/76
Foreign References:
| KR20100005535A | 2010-01-15 | |||
| KR20110085788A | 2011-07-27 | |||
| KR20090116136A | 2009-11-11 | |||
| KR20100045705A | 2010-05-04 |
Attorney, Agent or Firm:
Y.P.LEE, MOCK & PARTNERS (KR)
리앤목 특허법인 (KR)
리앤목 특허법인 (KR)
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