TEST SOCKET, TEST SOCKET MANUFACTURING METHOD, AND JIG ASSEMBLY FOR TEST SOCKET

Title:

TEST SOCKET, TEST SOCKET MANUFACTURING METHOD, AND JIG ASSEMBLY FOR TEST SOCKET

Document Type and Number:

WIPO Patent Application WO/2017/007200

Kind Code:

A3

Abstract:

A test socket manufacturing method comprises the steps of: preparing a PCB, which is provided with a bonding pad; bonding a conductive wire on the bonding pad; mounting a space, which exposes the bonding pad, on the upper surface of the PCB; mounting a jig, which covers the bonding pad, on the upper surface of the base; and injecting liquid silicone rubber into a jig assembly using the jig assembly as a mold, the jig assembly comprising the PCB, the space, the base, and the jig.

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Inventors:

PARK SUNG GYE (KR)
JUN JIN KOOK (KR)

Application Number:

PCT/KR2016/007183

Publication Date:

March 16, 2017

Filing Date:

July 04, 2016

Export Citation:

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Assignee:

OKINS ELECTRONICS CO LTD (KR)

International Classes:

G01R1/04; G01R3/00; G01R31/26; G01R31/28

Foreign References:

US20020130676A1	2002-09-19
KR101482911B1	2015-01-16
JP2004279046A	2004-10-07
KR20120037593A	2012-04-20
KR20100023261A	2010-03-04

Attorney, Agent or Firm:

ERUUM & LEEON INTELLECTUAL PROPERTY LAW FIRM (KR)

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