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Title:
TESTING TECHNIQUES FOR THROUGH-DEVICE VIAS
Document Type and Number:
WIPO Patent Application WO/2012/006249
Kind Code:
A3
Abstract:
Techniques for testing an electronic device with through-device vias can include using a probe card assembly with probes for contacting connection structures of the electronic device including ends of through-device vias of the electronic device. A pair of the probes can be electrically connected in the probe card assembly and can thus contact and form a direct return loop from one through-device via to another through-device via of a pair of the through-device vias with which the pair of probes is in contact. The electronic device can include test circuitry for driving a test signal onto the one of the through-device vias and a receiver for detecting the test signal on the other of the through-device vias.

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Inventors:
ELDRIDGE BENJAMIN N (US)
Application Number:
PCT/US2011/042850
Publication Date:
April 26, 2012
Filing Date:
July 01, 2011
Export Citation:
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Assignee:
FORMFACTOR INC (US)
ELDRIDGE BENJAMIN N (US)
International Classes:
H01L21/66
Foreign References:
JP3320517B22002-09-03
US20070046303A12007-03-01
JPH11160356A1999-06-18
US20060094162A12006-05-04
Attorney, Agent or Firm:
BURRASTON, N., Kenneth (60 East South TempleSuite 180, Salt Lake City UT, US)
Download PDF:
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