Title:
TETRAMETHYLBIPHENOL TYPE EPOXY RESIN AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/243994
Kind Code:
A1
Abstract:
The present invention relates to a tetramethylbiphenol type epoxy resin and a preparation method therefor, and, more specifically, a purification step in which carboxylic acid is used is added to a tetramethylbiphenol type epoxy resin preparation process so that the quantity of metal cations included in the tetramethylbiphenol type epoxy resin can be lowered, and thus the purity of the tetramethylbiphenol type epoxy resin can be improved.
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Inventors:
LEE EUN YONG (KR)
LEE JI AE (KR)
HONG SEONG HO (KR)
JUNG YONG SU (KR)
LEE GUI HANG (KR)
HWANG JAE SUK (KR)
PAEK MI JEONG (KR)
JUNG WON HO (KR)
KANG SUNG YEON (KR)
LEE JI AE (KR)
HONG SEONG HO (KR)
JUNG YONG SU (KR)
LEE GUI HANG (KR)
HWANG JAE SUK (KR)
PAEK MI JEONG (KR)
JUNG WON HO (KR)
KANG SUNG YEON (KR)
Application Number:
PCT/KR2023/008129
Publication Date:
December 21, 2023
Filing Date:
June 13, 2023
Export Citation:
Assignee:
SHIN A T&C (KR)
International Classes:
C08G59/24; C08G59/06; C08G59/68
Foreign References:
| KR20170091622A | 2017-08-09 | |||
| KR20200084371A | 2020-07-10 | |||
| KR20020031316A | 2002-05-01 | |||
| JP2003277467A | 2003-10-02 | |||
| JPH07247409A | 1995-09-26 |
Attorney, Agent or Firm:
KIM, Sung Ho (KR)
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