Title:
TEXTURE ETCHING SOLUTION COMPOSITION AND TEXTURE ETCHING METHOD FOR CRYSTALLINE SILICON WAFER
Document Type and Number:
WIPO Patent Application WO/2012/169722
Kind Code:
A1
Abstract:
The present invention relates to a texture etching solution composition and a texture etching method for a crystalline silicon wafer, and more specifically, to a texture etching solution composition and a texture etching method for a crystalline silicon wafer, comprising an optimum content of: an alkali compound; a polysaccharide; a silica compound; and a remainder of water, thereby enhancing the uniformity of a texture having a fine pyramid structure on the surface of the crystalline silicon wafer so as to maximize solar light absorbency, and reducing the rate of light reflection so as to increase light efficiency.
Inventors:
HONG HYUNG PYO (KR)
LEE JAE YUN (KR)
PARK MYUN KYU (KR)
LEE JAE YUN (KR)
PARK MYUN KYU (KR)
Application Number:
PCT/KR2012/001750
Publication Date:
December 13, 2012
Filing Date:
March 09, 2012
Export Citation:
Assignee:
DONGWOO FINE CHEM CO LTD (KR)
HONG HYUNG PYO (KR)
LEE JAE YUN (KR)
PARK MYUN KYU (KR)
HONG HYUNG PYO (KR)
LEE JAE YUN (KR)
PARK MYUN KYU (KR)
International Classes:
C09K13/02; C23F1/24; H01L21/306
Domestic Patent References:
| WO2011020632A1 | 2011-02-24 |
Foreign References:
| JP2009206335A | 2009-09-10 | |||
| JP2005019605A | 2005-01-20 | |||
| EP2372779A2 | 2011-10-05 |
Attorney, Agent or Firm:
LEE, Joon Ho et al. (KR)
이준호 (KR)
이준호 (KR)
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Claims: