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Patent Searching and Data


Title:
TFT ARRAY SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/205482
Kind Code:
A1
Abstract:
The present invention provides a TFT array substrate. The TFT array substrate is provided with a third conductive layer, with the third conductive layer being respectively connected to a first conductive layer and a second conductive layer via a first through hole and a second through hole, and the third conductive layer being provided with a first opening and a second opening at intervals. The projection of the first opening in a vertical direction is located on one side of the edge of the bottom of the second through hole, and one end of the first opening protrudes from one end, close to the first through hole, of the edge of the bottom of the second through hole; and the projection of the second opening in a vertical direction is located on one side of the edge of the bottom of the first through hole, and one end of the second opening protrudes from one end, close to the second through hole, of the edge of the bottom of the first through hole, and therefore, when the third conductive layer is cracked at the edges of the first through hole and the second through hole close to each other due to a breakdown of static electricity, the first opening and the second opening can block the crack, thereby preventing the crack from causing the breakage of the first conductive layer and the second conductive layer, such that the connection reliability of the first conductive layer and the second conductive layer is ensured, and the quality of the product is improved.

Inventors:
LIAO ZUOMIN (CN)
LI YANYANG (CN)
Application Number:
PCT/CN2018/107831
Publication Date:
October 31, 2019
Filing Date:
September 27, 2018
Export Citation:
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Assignee:
WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD (CN)
International Classes:
H01L21/77
Foreign References:
CN108550580A2018-09-18
CN107329338A2017-11-07
CN107180838A2017-09-19
CN103984170A2014-08-13
US20170168334A12017-06-15
Attorney, Agent or Firm:
COMIPS INTELLECTUAL PROPERTY OFFICE (CN)
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