Title:
THERMAL APPARATUS FOR ENGAGING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO2004086827
Kind Code:
A3
Abstract:
An apparatus for controlling the temperature of an electronic device utilizes a thermal head attached to a base structure (36) including an integral isolation arrangement. For example, the isolation arrangement can be formed as a planar spring (69) defined by slots in the base structure (36). The base structure (36) has a manifold configured to route refrigerant fluid between the thermal head (20) and components (32) of a refrigeration system. The isolation arrangement is normally planar but is movable to facilitate engagement of the thermal head (20) with the electronic device. The isolation arrangement also compensates for variations in the planar orientation of the electronic device.
Application Number:
PCT/US2004/007890
Publication Date:
January 20, 2005
Filing Date:
March 16, 2004
Export Citation:
Assignee:
KRYOTECH INC (US)
International Classes:
F25B1/00; F25B41/04; F25B49/00; F25D23/12; F28D15/02; G01R31/28; G05D23/00; H01L23/24; H01L23/34; H01L23/473; H05K7/20; H05K; (IPC1-7): H01L23/34; F25B1/00; F25B41/04; F25B49/00; F25D23/12
Domestic Patent References:
| WO2002097342A1 | 2002-12-05 |
Foreign References:
| US20030019234A1 | 2003-01-30 | |||
| US6184504B1 | 2001-02-06 |
Other References:
See also references of EP 1611610A4
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