Title:
THERMAL BONDING FILM, METHOD FOR PRODUCING SAME, AND WATER TANK ADHESION STRUCTURE USING SAME FOR AIR-TO-WATER SOURCE HEAT PUMP
Document Type and Number:
WIPO Patent Application WO/2022/173105
Kind Code:
A1
Abstract:
Disclosed is a water tank adhesion structure using thermal bonding film for air-to-water source heat pump, the thermal film, which is activated by the temperature of the hot water and is inserted between a hot water tank and insulation material for tight adhesion therebeween, activating when hot water is supplied, which is when insulation is actually necessary.
Inventors:
HONG SANGHYUN (KR)
Application Number:
PCT/KR2021/019104
Publication Date:
August 18, 2022
Filing Date:
December 15, 2021
Export Citation:
Assignee:
LG ELECTRONICS INC (KR)
International Classes:
C08J5/18; B32B5/18; B32B7/12; C08F6/18; C08F212/08; C08L25/08; C09J125/08; F24D11/02; F24F5/00; F25B30/00
Foreign References:
| KR20160021800A | 2016-02-26 | |||
| JPH09125021A | 1997-05-13 | |||
| JP2020045464A | 2020-03-26 | |||
| KR20130051533A | 2013-05-21 | |||
| JP2007212060A | 2007-08-23 | |||
| KR20180009523A | 2018-01-29 |
Attorney, Agent or Firm:
DAE-A INTELLECTUAL PROPERTY CONSULTING (KR)
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