Title:
THERMAL BONDING METHOD AND APPARATUS
Document Type and Number:
WIPO Patent Application WO/1999/012737
Kind Code:
A1
Abstract:
A thermal bonding method wherein at least two members are thermally bonded to each other with an adhesive by pressurizing and heating a laminate formed by laminating at least two members on each other via the adhesive, comprising bringing at least one member of the laminate close to a heated radiation heater and pressing the laminate in a radition heat-applied state; and a thermal bonding apparatus comprising a radiation heater, a member for supporting the laminate with at least one member thereof brought close to the radiation heater, and a pressurizing unit adapted to approach, contact and pressurize the laminate supported on the supporting member and then move away from the laminate to stop applying a pressure to the same.
Inventors:
KOMINE HARUO (JP)
NISHIMURA AKIRA (JP)
NISHIMURA AKIRA (JP)
Application Number:
PCT/JP1998/003999
Publication Date:
March 18, 1999
Filing Date:
September 07, 1998
Export Citation:
Assignee:
JAPAN BRAKE IND CO LTD (JP)
KOMINE HARUO (JP)
NISHIMURA AKIRA (JP)
KOMINE HARUO (JP)
NISHIMURA AKIRA (JP)
International Classes:
B32B37/10; B29C43/00; B29C65/00; B29C65/14; B29C65/18; B29C65/48; C09J5/06; F16D69/04; B29C35/02; B29C35/08; B29C43/18; B29L9/00; B29L31/16; (IPC1-7): B32B31/20; F16D69/04
Foreign References:
| JPS58131062A | 1983-08-04 | |||
| JPH05278116A | 1993-10-26 |
Other References:
See also references of EP 1018425A4
Attorney, Agent or Firm:
Hotaka, Tetsuo (Tsukiji 2-chome Chuo-ku Tokyo, JP)
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